Electronics Forum | Mon Sep 03 09:48:12 EDT 2007 | davef
Joris We don�t know the maximum period to store the boards without having problems with blowholes. Too many variables to determine. We prefer to just fix the problem, but understand that you have stock that you need to build-down. Determining mois
Electronics Forum | Tue Feb 11 10:51:20 EST 2020 | slthomas
To predict whether or not a first pass part is going to come off during the second pass you need to calculate the ratio of weight/soldered surface area. According to a couple of different sources that I've dug up, maximum is around 44 grams/in.^2. I
Electronics Forum | Thu Nov 01 17:40:52 EST 2001 | davef
Listen to Wolfgang. Your dull solder connection is a process indicator. Some 63Sn / Au solder connections look grainy, depending on how your process them and the materials involved. Gold dissolving in tin forms an intermetallic compound [AuSn4] th
Electronics Forum | Mon Aug 19 20:45:31 EDT 2002 | davef
Bob Willis and Phil Zarrow have had a running commentary on the ability of reflowed solder to hold components on the bottom side during reflow. You can find references to their component weight to pad area rations in the fine SMTnet Archives. The
Electronics Forum | Sun Feb 09 18:20:24 EST 2020 | richardcargill
Does this only happen with certain feeders or certain components? We have a few regularly used components that experience the same problem ( Philips SMT machinery ) where the cover tape is just too sticky. Experience taught us which components will c
Electronics Forum | Tue Nov 26 13:56:09 EST 2013 | aaronpavone
If I wanted to verify my process to ensure that it is not exceeding maximum lead temperature for the determined time on a component data sheet while soldering, where should i measure from? I am currently measuring from the tip of the lead on the seco
Electronics Forum | Tue Oct 09 05:38:29 EDT 2018 | dfl
Hi, my Quad IV-c is showing a really dark image on the camera and its VERY difficult to see the components pads to make the adjusts. I already check the monitor brightness (at maximum and I can see the crosshair, so the monitor is good) and already
Electronics Forum | Sun Dec 08 09:59:39 EST 2013 | davef
Component fabricator is concerned about the temperature of the lead at the point where the lead enters the component body. So, if you sink temperature at that point, you will assure a lower chance of damaging the component.
Electronics Forum | Tue Sep 12 19:36:17 EDT 2006 | davef
We've been soldering leadfree components for maybe 15 years. We'd be surprised not to be able to store components for at least a year, not that we purposely do that. Component fabricator process determine the maximum storage time for components. M
Electronics Forum | Wed Mar 28 10:56:56 EST 2001 | jseagle
Does anyone know the formula for calculating the grams per sq cm of lead for mounting bottomside unglued components? Thanks James
