Industry News | 2012-06-01 09:09:55.0
Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4x4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP soldering defect.
Industry News | 2013-03-01 08:06:06.0
fastPACK 0 H 2nd gen & fastPHASE 0
Industry News | 2012-10-08 07:37:53.0
High efficiency of power conversion circuits - a design goal on its own
Industry News | 2012-01-13 13:09:12.0
JUKI Corporation releases high-speed chip shooter KE-3010, high-speed flexible mounter KE-3020V/3020VR and electric double tape feeder EF08HD, upgrading its high-speed, high-quality product lines.
Industry News | 2021-05-31 04:59:56.0
Weight is one of the essential parameters that need to be considered in many fields. The weight of the object needs to be weighted accurately to determine the content of the object. A load cell is commonly used in these situations where accuracy and precision of the weight of the object are important. The load cell is able to measure the weight of object with high accuracy.
Industry News | 2019-11-05 22:05:41.0
The printed circuit board, or PCB, is responsible for connecting all the components with each other in your electronic assembly. Making just one tiny error in the design could lead to complete failure. PCB layout design requires ardent precision and great technological skills.
Industry News | 2008-03-04 12:05:25.0
APEX, NC - January 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its new iineo-II SMT platform in booth 1624 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, in Las Vegas.
Industry News | 2008-09-14 15:09:42.0
APEX, NC - September 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will showcase its iineo-II SMT platform in booth 423 at the upcoming IPC Midwest Conference & Exhibition that is scheduled to take place September 24�25, 2008 at the Renaissance Schaumburg Hotel & Convention Center.
Industry News | 2009-03-10 19:05:30.0
APEX, NC - January 2009 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its IINEO-2 SMT platform in booth 473 at the upcoming APEX 2009 Conference & Exhibition that is scheduled to take place March 31-April 2, 2009 in Las Vegas.
Industry News | 2013-03-18 17:10:49.0
Europlacer, will highlight the new ii-Feed and the multi award-winning iineo platform in representative smartTec GmbH’s booth #7-219 at the upcoming SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
