Electronics Forum | Wed Jan 11 22:47:31 EST 2006 | davef
We didn't intend to light anyone's fur on fire [get anyone's underwear in a knot, roil the waters, have a cow man] about consultants. The Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Mon Jul 14 09:41:35 EDT 2008 | davef
Q1. Do we really need to follow the IPC J-STD-001 Solder purity? A1. Yes, you should control impurities in solder. Further information: * "Allowable concentration of contaminating elements in solder: impurities are harmless unless their level goes to
Electronics Forum | Mon Feb 22 13:39:22 EST 1999 | Justin Medernach
| Can anybody give me the Pros and Cons of of using Cartridges over jars and/or vice-versa. Also, if using cartridges, what is the best way to keep the paste from seperating, short of buying a mixer that cost over $5000.00 | Thanks, | Bill | Bill,
Electronics Forum | Thu Dec 24 01:38:36 EST 1998 | Chris Grendler
I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. My current 0402 chip pad sizes on alumina and FR4 substrates are .022"X.
Electronics Forum | Mon Dec 22 16:02:22 EST 1997 | Justin Medernach
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? Vincenzo, Voids in solder joints can be caused by a number of factors. Let's begin with the flux vehicle in your soldering media. If the prope
Electronics Forum | Tue Apr 13 22:48:11 EDT 2004 | Ken
I assumed the balls were tin/silver 221C or tin/silver/copper 218C liquiduous....but, this is obviously not the case. It looks like you balls are almost pure tin (mp=238C) You are correct. This is exactly the same as using 10/90 high temp balls o
Electronics Forum | Wed Aug 31 10:26:24 EDT 2005 | Carmichael
I respectfully disagree with vapor phase or reflow oven being the technology of choice here. Have you considered straight conduction heating? (ie: hot plate) If you have a lot of these to do you can purchase in-line conduction ovens like the Sikama o
Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe
I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching
Electronics Forum | Tue Dec 22 12:32:16 EST 1998 | Earl Moon
| Folk's, | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture,
