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Qualification and Reliability of Microvias
Technical Library | 2016-05-12 16:29:40.0
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
Technical Library | 2021-12-21 23:21:34.0
Points of discussion in "HDI Microvia Technology – Cost Aspects" are: - Reasons for the use of HDI technology - Printed circuit board (PCB) size - Number of layers - Stack-up and complexity - Other important cost influences -–Design rules -–Drilling costs -–Microvia filling
Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture
Technical Library | 2015-05-14 15:45:45.0
The Printed Circuit Board industry has seen a steady reduction in pitch from 1.0mm to 0.4mm; a segment of the industry is even using or considering a 0.25mm pitch. This has increased the use of stacked microvias in these designs. The process of stacking microvias has been practiced for several years in handheld devices; however, the devices generally do not operate in harsh conditions. Type 1 and Type 2 microvias have been tested over the years and have been found to be very reliable. We do not have enough test data for 3 and 4 stack microvias when placed on and off buried via. The main objective of this study was to understand the reliability of 3 and 4 stack microvias placed on and off a buried via.
Technical Library | 2021-05-26 00:53:26.0
This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster, smaller and higher performance communication and electronic devices, build-up technology incorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiring density, reduced line widths, smaller through-holes and microvias are all attributes of these High Density Interconnect (HDI) packages. Filling the microvias with conductive material allows the use of stacked vias and via in pad designs thereby facilitating additional packaging density. Other potential design attributes include thermal management enhancement and benefits for high frequency circuitry. Electrodeposited copper can be utilized for filling microvias and provides potential advantages over alternative via plugging techniques. The features, development, scale up and results of direct current (DC) and periodic pulse reverse (PPR) acid copper via filling processes, including chemistry and equipment, are described.
LPKF ZelFlex � Pneumatic Rapid Stretching Frames for most world-wide available SMT printers, www.zelflex.com, screen printing, stencil printing, Pick&Place, reflow, SMT Assembling, Rapid Prototyping, Laser Cutting and Drilling, microvia, www.lpkf.si
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PCB-supplier, Flexprint, HDI, Microvia, blind via, burried vias ect.
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Rigid and Flex Circuit Board Laser Processing Services including SMT Stencils, Microvia Drilling, Selective Solder Mask Rework, PCB Rework, Laser Marking, Part Excising or Routing, Cavity / Window / Limited-Depth Skiving.
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One-Stop Solution for PCB & Prototype Assembly Expanded PCB manufacturing capabilities to support advanced designs with demanding requirements including laser-drilled microvias, cavity boards, heavy copper up to 20 oz., via-in-pad