Industry News | 2023-09-15 10:11:02.0
Transition Automation, Inc. is pleased to announce Squeegee Buddy, a new tool for SMT printer users to help improve process quality and organization. This SMT solution provides a secure storage for squeegees in the form of a frame that looks similar to a stencil frame. As such, it may be inserted into stencil cleaners to clean squeegees without damaging them. Capable of use for both squeegee storage and squeegee cleaning, the tool protects the squeegees from damage by keeping them within the outside dimensions of the frame. In this way, if the frame were to drop and fall on the floor, there would be no way for the squeegee blade to be impacted or damaged. This frame can be hung on a wall or inserted into a stencil frame rack to store the squeegees between operations.
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Industry News | 2011-08-19 05:08:40.0
Nickel gold is one of the most popular surface finishes used in the PCB assembly industry with many advantages but also process and reliability issues.
Technical Library | 2013-07-18 12:12:40.0
Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders.
Department of Chemical Engineering, University of Massachusetts
Industry News | 2007-12-05 23:40:50.0
BALVE, GERMANY � December 4, 2007 � The Balver Zinn Group, a leading provider of high-quality anodes with various alloys as well as soft solders and special wires, announces that it is positioning itself to develop the opportunities presented by the global license it has acquired for solder pastes and wire using the proven SN100C alloy developed by Nihon Superior Co. Ltd.
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
Industry News | 2009-01-22 20:22:57.0
The DEK team is inviting visitors to this year's Southern Electronics Show to unlock the potential of their print process with a wide range of advanced technologies. Being held over 11th � 12th February 2009 at FIVE in Farnborough, UK, Southern Electronics will see the mass imaging leader showcase a wide range of Process Improvement Products and Productivity Tools designed to help customers 'expect more'.
Industry News | 2007-12-03 22:04:21.0
GREELEY, CO � December 3, 2007 � FCT Solder, a division of FCT Assembly, announces that it has been awarded a Global Technology Award with Nihon Superior Co. Ltd. in the category of Soldering Materials for the innovative SN100C Paste.
Industry News | 2015-08-26 18:25:32.0
Nihon Superior Co. will exhibit in Booth #419 at SMTA International, scheduled to take place Sep. 27 - Oct. 1, 2015 at the Donald Stephens Convention Center in Rosemont, IL. This year, Nihon Superior will celebrate its 50th anniversary since first introducing joining materials to the market. The most well-known solder; SN100C® has seen its 15th anniversary and its usage is still expanding. The reliability of SN100C has been proven in a wide range of electronics assembly products. The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.
Industry News | 2007-04-03 12:58:45.0
04/03/2007
