Low Pressure Molding with Macromelt. Low pressure molding is an innovative manufacturing process between injection molding and potting. A cost effective and environmentally friendly alternative to epoxy potting for fragile electronic components. When
Industry News | 2016-02-01 03:04:39.0
Hampoo Showcases its' one-stop PCB Solution.
Industry News | 2012-06-04 11:39:23.0
MARTIN has expanded its successful EXPERT 04.6 rework station series with a new configuration to rework LEDs and power components on heavy (metal or ceramic) boards.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2010-09-30 17:36:09.0
Presentation entitled "Thermal Management in End Applications: Dissipating the Heat Away from the Base of LEDs" to address material specifications for Metal Core / Aluminum PCBs for LED Applications.
Industry News | 2011-04-04 15:48:55.0
Executive Associate Dr. Karl H. Dietz, of Weiner International Associates has completed preparation of the tutorial "HDI, Fine Line Processing." This is the capstone of his new suite of tutorials and seminars for bare board and substrate fabrication.
Industry News | 2008-05-03 16:43:51.0
One of the UK's leading design and manufacturers of standard and bespoke microwave component technology has invested in new machinery at its Presteigne microwave printed circuit board (PCB) production facility, with the aim of improving processes, efficiency and manufacturing capability.
Industry News | 2007-11-04 19:52:48.0
Essemtec will introduce the SP600 Batch Printer with Shuttle System in booth A5-277 and A5-278 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany. The SP600 combines the convenience of a batch printer with the advantages of a fully automatic system.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2017-11-29 14:28:56.0
Nordson MARCH announces its new-generation RollVIA™ plasma system, a completely self-contained vacuum plasma system with production-proven, roll-to-roll material handling for flexible printed circuit board (PCB) manufacturing. The new RollVIA incorporates unique vacuum and gas flow technology, new process control technology, updated electrode designs, and superior temperature management with precise control of roll speed, tension, and edge guidance for uniform plasma treatment of substrates as thin as 25 microns. The RollVIA system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during production of PCBs.
