Electronics Forum: onto (Page 6 of 98)

Gold Flash with QFN28 problem

Electronics Forum | Thu Mar 30 09:32:54 EST 2006 | russ

Not arguing dan, but are you positive that they are not copper? anyway, what is happening is as the parts sucks down onto the board from reflow the extra paste is notnecessarily sqeezed out but it has no place to go. So it will form this ball on th

Epoxy on bottom of SMT component

Electronics Forum | Fri Nov 23 16:09:01 EST 2007 | davef

We're not real clear about what you're trying to discuss, because most capacitors are packaged in epoxy with a solderable termination on each end. But lets throw a couple of ideas at the wall and see what sticks. If this epoxy is: * From the capaci

semi-manual SMT placement

Electronics Forum | Mon Feb 09 10:19:27 EST 2009 | tomg_fla

I am looking for a semi-manual system that an operator can use on a 2 meter conveyor to assist in part placement onto printed boards. We do some prototype assemblies where we don't get parts tape and reeled. Am looking at something that can pick up a

Solderability Issues

Electronics Forum | Tue Jul 20 15:10:00 EDT 2010 | vetteboy86

Recently we have expereinced solder issues with our reflow process. The issue is random and doesn't effect every assembly. I'm seeing extreme solder wicking, no solder flow onto the pads, only onto the leads of the components. I have tried to hand

Quad IVc AutoProgram

Electronics Forum | Fri Apr 05 14:17:11 EDT 2013 | leemeyer

I have no idea why this limitation would be programmed in. Like I said before there a lot of wierd quirks whith this software and you may have just found one. Pre-assigning will not help if the software sees a mismatch between the feeder plate and th

Component FOD / Solder balls

Electronics Forum | Tue Jul 08 10:29:56 EDT 2014 | mleber

We are experiencing FOD coming off of a Cooper Bussman fuse. The components are dark with a metal like substance. In our testing based on what we were seeing we placed components onto a piece of FR4, placed a drop of flux onto the component and ran t

Siemens SIPLACE CF - Low vacuum on head

Electronics Forum | Wed Jan 30 08:27:37 EST 2019 | mst3000

Hi there. We are facing an issue with the placing head of our SMT machine SIEMENS SIPLACE CF 2004 model where the vacuum reading is low (820 instead of 900). This is resulting in that the components are either falling off when the head moves onto the

Avoid mixup reels unloading in Siplace

Electronics Forum | Thu Jul 04 10:37:22 EDT 2019 | spoiltforchoice

Keep some empty tape and splice a long enough piece onto the foot of the tape to keep the strip and the reel connected.(Brass shim type splice being the most reliable) Or Print 3.5mm labels (Brother PTouch make one this size) and stick those onto y

Re: ict nail for double sided reflow

Electronics Forum | Tue Jul 18 20:17:25 EDT 2000 | Dave F

Bluto: Either: * Give the springs in your probes some spinach ... OR * Print some paste onto your test pads Popeye

Re: BGA REBALL

Electronics Forum | Tue Jun 27 11:39:16 EDT 2000 | Chris May

Leon, Have you tried a piece of glass, deposit some flux onto glass, place the BGA in the glass to flux it, replace BGA and reflow using existing solder deposition ?? Regards, Chris


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