Electronics Forum | Thu Jun 15 16:28:48 EDT 2017 | davef
You should be searching on RN Wild, not Roger Wild This might be a good starting point https://supplychain.gsfc.nasa.gov/docs/sc2011j.planteb.pacquetteasof1020.pdf
Electronics Forum | Tue Aug 07 04:19:38 EDT 2001 | wbu
What happend yesterday (06.August.) that Netscape isn�t good anymore for viewing the pages of SMTnet? Same thing with Apple computer and Netscape. Had to find someone with MS explorer installed to get this out. Hope it�s not a discrimination or somet
Electronics Forum | Thu Jun 15 14:14:18 EDT 2017 | pfuhrman
I have seen a few references in this forum to an old study (1980s?) by Roger Wild at IBM. But I cannot find a published report or usable reference to one. davef mentioned the SMTnet archives as a possible source, but that has also been a dead end.
Electronics Forum | Tue Oct 10 03:14:36 EDT 2017 | bukas
THIS IS NOT A PCB FILE! DO NOT OPEN IT!
Electronics Forum | Sun Feb 22 05:53:25 EST 1998 | Ron Lahat
Stencil Opening Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable
Electronics Forum | Wed Oct 03 21:28:38 EDT 2001 | davef
A firm grasp on the sublime. Mike points-out a good reason to describe Claude's problem as "open connections" or "open solder connections"? [Ahhh geez, wut a spoil spurt]
Electronics Forum | Thu Sep 12 01:49:28 EDT 2002 | ck
Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing. thks
Electronics Forum | Wed Sep 15 23:00:36 EDT 2004 | pdeuel
if opens in same aria check for mask to via coverage for that pad. We had vias pulling solder from pad. We did not have totally opens but capalry from via was as strong as capalry to ball / pad creating small joint aria.
Electronics Forum | Mon Jun 27 21:28:15 EDT 2011 | samsim
It seems to be no solder paste release at certain stencil opening, you may need to enlarge the stencil opening. By the way what is the area ratio for the opening and how is the shape (round/square/diamond)?
Electronics Forum | Wed Apr 16 19:17:11 EDT 2014 | hegemon
OK, POP already done, and you are mounting the POP device. You are seeing opens. Opens at the device/PWB? or opens at the device/device interface? Or possibly both? 'hege
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