Electronics Forum | Thu Oct 01 18:20:29 EDT 1998 | Dave F
| Has anybody know of HAST standard applicable to PBGA packages? Would appreciate help. | | Thanks. Benji: BGAs are not well documented from a standards stand-point. What is HAST? Dave F
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Sat Nov 18 08:44:26 EST 2006 | davef
What is missing from 033B?
Electronics Forum | Sat Nov 18 09:47:39 EST 2006 | jdumont
Yea that sounds about right. Thanks a lot for the help. Take care
Electronics Forum | Mon Aug 18 09:28:04 EDT 2008 | eyalg
The following standard is used to determine warpage: "High Temperature Package Warpage Measurement Methodology" JESD22B112
Electronics Forum | Mon Oct 22 17:47:47 EDT 2001 | davef
We on SMTnet have danced around this component package, but there is not a "background" of knowledge in the fine SMTnet Archives. We in our company use this component package, but have not seen the problems you discuss. [We see other problems.] Th
Electronics Forum | Sun Oct 31 19:36:19 EST 1999 | JC Leigh
Can you please give me a pointer on where to find the component package orientation standard in the IPC? I think we'll work up a spec sheet for the folks in purchasing and let them handle the vendor side of this problem. Thanks for your help! JC
Electronics Forum | Fri Mar 14 11:05:26 EST 2003 | steves
Garth, Try searching on "capacity planning." This is a standard tool available in most MRP and ERP software packages. You may already own it in whatever software package you use for your material planning. Steve
Electronics Forum | Wed Mar 08 18:09:52 EST 2006 | jax
Part is most likely a QFN package. IPC-610-D has standards on solder quality for this new type of package.
Electronics Forum | Fri Apr 06 09:45:08 EDT 2007 | pjc
CSP= Chip Scale Package, meaning small. A MicoBGA is a CSP, while a regular BGA is not a CSP. CSPs require fewer steps to fabricate than standard BGAs. A commonly quoted definition of a CSP is a package where the body size is
