Electronics Forum | Thu Aug 12 17:07:09 EDT 1999 | Brian Wycoff
| Hello, | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | B.Regards, | Felix | I have a process cause and effect diagram for the entire print
Electronics Forum | Fri Aug 13 00:05:12 EDT 1999 | Felix Mung
| | Hello, | | | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | | | B.Regards, | | Felix | | | I have a process cause and effect diagram for
Electronics Forum | Wed Aug 15 17:30:43 EDT 2001 | peterson
Hello All, We have an MPM 2000 screen printer. My question is this: we are having a stencil made that has both top and bottom side on a single foil. Our Process people are unsure if the machine parameters will allow it. The board size is 19x15. Can i
Electronics Forum | Wed Jan 30 17:49:41 EST 2002 | davef
PCB never expire, they just become more difficult to solder. [Many shops impose �shelf life� periods for their boards, but they aren�t going to discard the boards if the exceed the limits, unlike they would with some other process materials.] IDENT
Electronics Forum | Fri Jul 15 10:34:28 EDT 2005 | dougs
how do you do it stephen? i'm interested to know what methods can be used to monitor a process such as this. is it best to set-up the wave machine parameters as russ and davef were talking about, what then, how do we know what effect a change in
Electronics Forum | Fri Oct 28 08:37:06 EDT 2005 | pavel_murtishev
Once again, it isn�t the process problem. It�s machine problem. I�ve tried to change all of the parameters: printing speed, printing pressure, snap-off speed, snap-off distance, etc. No any effect. Defect still exists with different process parameter
Electronics Forum | Thu Dec 15 19:47:43 EST 2005 | Liza
Hi GS, You mentioned that polystyrene should be sealed by low method. We are currently using the ffg parameters for polystyrene monolayer dull finish carrier tape and AA cover tape. Are these considered low by standard? These are the parameters r
Electronics Forum | Wed Jun 18 07:58:23 EDT 2008 | davef
Hi Stu Some seem to believe that vacuum baking will suck moisture from components and boards. Actually, the case is just the opposite. * Without proper definition and control of process parameters, vacuum baking retards the removal of moisture * Eve
Electronics Forum | Mon Mar 17 07:45:27 EDT 2008 | jackson
Hi SWAG, Bridging most contributed is from printing set up which is the parameter setting as well the board thickness setting. I would suggest you may check the parameter setting which mainly the squegee speed, stencil gap between PCB contact, print
Electronics Forum | Tue Jul 01 18:51:06 EDT 2008 | proy
I am learning to use this SPM now, and I found that when I go to define a board size, you select the parameter box, then the parameter (like Board size X....) - I can only change the value by rolling the mouse ball, the side bar which is shown in the
