Full Site - : pin discolor after reflow (Page 6 of 33)

Christopher Associates' Jasbir Bath to Chair Reflow Assembly Session at IPC APEX EXPO

Industry News | 2011-03-14 17:53:00.0

Christopher Associates announces that Jasbir Bath, Consulting Engineer, will Chair the session titled "Reflow Assembly" at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas. The session will take place Tuesday, April 12, 2011 from 1:30-3 p.m.

Christopher Associates Inc.

SHENMAO Offers Enhanced Solder Joint Encapsulation Material Flux

Industry News | 2022-06-24 10:13:15.0

SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.

Shenmao Technology Inc.

FCT Assembly Debuts NC676 No-Clean Leaded Solder Paste

Industry News | 2010-10-26 22:46:06.0

FCT Assembly introduces the new NC676 no-clean leaded solder paste, featuring its latest technology in print and reflow in the no-clean category.

FCT ASSEMBLY, INC.

FCT Assembly Debuts NL930 Lead-free No-Clean Solder Paste

Industry News | 2009-11-02 21:59:00.0

GREELEY, CO —FCT Assembly premiers NL930, a lead-free, no-clean solder paste that features the company’s latest technology in print and reflow of paste in the no-clean category.

FCT ASSEMBLY, INC.

Cobar Expert Gerjan Diepstraten to Discuss Reflow Soldering during IPC Midwest 2012 Conference

Industry News | 2012-07-25 15:16:14.0

The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference

Balver Zinn

FCI Receptacles Take to Standard SMT Processes

Industry News | 2003-04-15 08:23:22.0

Metral TINT back panel receptacles are compatible with standard pin-in-paste SMT processes, eliminating costly secondary assembly operations including heat staking, wave soldering or press fitting.

FCI

BPM Microsystems to Demonstrate the 2800ISP at the Houston SMTA Expo

Industry News | 2013-03-13 15:50:03.0

BPM Microsystems announces that it will exhibit its award-winning 2800ISP parallel in-system device programmer at the Houston SMTA Expo, scheduled to take place March 14, 2013 at the Stafford Centre in Stafford, TX.

BPM Microsystems, Inc.

BPM Microsystems’ Cutting-Edge Technology to be Displayed at DESIGN West 2013

Industry News | 2013-03-18 09:37:22.0

BPM Microsystems announces that it will exhibit its award-winning 2800ISP parallel in-system device programmer in Booth #2134 at the DESIGN West conference and exhibition, scheduled to take place April 22-25, 2013 at the McEnery Convention Center in San Jose, CA.

BPM Microsystems, Inc.

Vitronics Soltec Products Win Two SMT China Vision Awards in Reflow and Selective Soldering Categories

Industry News | 2017-05-01 14:53:34.0

ITW EAE’s Vitronics Soltec earned two coveted VA Excellent Awards from the SMT China Vision Awards at the recent NEPCON China exposition and conference in Shanghai. The CATHOX™ Catalytic Thermal Oxidizer was recognized in the Reflow Soldering category and the ZEVAm took the prize in the Selective Soldering category.

Vitronics Soltec

BPM Microsystems accepts its 20th industry award during the IPC APEX EXPO

Industry News | 2013-02-20 07:14:02.0

BPM Microsystems announces that it has been awarded a 2013 New Product Introduction (NPI) Award in the category of Device Programming for its 2800ISP parallel in-system device programmer.

BPM Microsystems, Inc.


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