Electronics Forum | Thu Apr 17 17:41:13 EDT 2003 | Takfire
Dave, I truly appreciate your efforts in providing information. Excellent input with the fishbone data. I will put together a presentation later tonight. I hope to return the favor in the future in regards to MLCC manufacturing or application.
Electronics Forum | Sun Feb 27 13:42:44 EST 2005 | pmdeuel
So true, We had paste flux supplied to us from Alpha metals. It was the same as used in the solder paste. The major problem we noted was the in ability to control the ratio of paste to flux resulting in lots of voids. When we mixed enough to get the
Electronics Forum | Wed Apr 30 12:30:14 EDT 2003 | Guillermo
Hello, I would like to ask for cooments/advices about the inspection of small solder deposits inspection (aprox 4 mills). We tried with X ray and Scanning acoustic microscope but it looks like due to the small size, we could not be sure to get all t
Electronics Forum | Thu Feb 24 23:11:51 EST 2011 | kemasta
HI I have this BGA short issue, I took x-ray image, the solder ball having big void. We suspect the pad on BGA was oxidie. Reject percentage quite low, only 5 out of 6000. But after the BGA re-ball, is work fine. Anyone have any idea to trobleshoot
Electronics Forum | Wed Apr 16 16:55:38 EDT 2003 | russ
Thanks for the info, Here is a couple more questions (and you thought you were done) What size are these caps /res? how thick is your stencil? what type of oven are you using? what is the finish of the board? Anyway, it seems like (from a distance)t
Electronics Forum | Thu Apr 17 13:00:28 EDT 2003 | Takfire
Russ, The caps are 0603 case size. I am not sure about the manufacturing details, as I work for the capacitor supplier. The manufacturing details are unclear at the moment, as the customer (South of the border) has not released such detailed inform
Electronics Forum | Thu Apr 17 17:38:57 EDT 2003 | Takfire
Dave, I am not exactly sure what is driving them to believe that this is a capacitor issue. It is unfortunate, that this belief has slowed their activity in further understanding their manufacturing process. The caps are BME (Base Metal Electrode
Electronics Forum | Wed Feb 23 17:24:06 EST 2005 | Austinj
Solder spattering, solder balls, components "popping" off pads........ Not a serious chemical reaction, however, as replied to by KEN on 12/21/04 in a similar article: "Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my m
Electronics Forum | Tue Dec 21 11:46:29 EST 2004 | KEN
Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my mind, is an unacceptable technique. Why? 1. Can not control metals content. 2. Probably not adding the same chemestry flux...as paste flux has many different addi
Electronics Forum | Tue Jun 07 08:31:57 EDT 2011 | bootstrap
I am building a rugged digital video camera product that essentially is just a sandwitch of 3 parts: #1: front piece is machined aluminum with C-mount thread #2: middle piece is 1/16" printed circuit board #3: back piece is machined aluminum The
