Electronics Forum | Mon Jan 12 08:59:57 EST 2004 | Paul F
I may have a similar problem at the moment with a QFP-68. Do the unsoldered leads leave a perfectly formed footprint in the reflowed solder? Do you usually find this issue occurring towards the corners of the QFP rather than in the middle of a row?
Electronics Forum | Mon Feb 16 20:47:46 EST 2004 | davef
Removal: Run the board through the reflow oven with the cooling zone turned off. Then pick the QFP with a pair of tweezers. Replace: Don't clean the solder from the QFP. Just dip them in tacky flux, place the component, and reflow.
Electronics Forum | Mon Jun 26 17:51:17 EDT 2006 | russ
Just don't see it happening Bolos, aint gonoing to make up 3 bucks with BGA vs. QFP. Both packages from an assembly standpoint should be equal dollars. Why do you want BGA over QFP? Is it because you think your process will be better with BGA? Ru
Electronics Forum | Mon Nov 12 01:18:29 EST 2007 | sin4d
Hi, ALL I experience some QFP with wetting issue on the heel of the lead. There is no fillet wetting on the heel which causes reject bt the customer, but not all the QFP. Could anyone pls help what is the causes of this problem, it is due to oxidati
Electronics Forum | Thu Aug 05 11:36:48 EDT 2004 | Tore
Hi, Here is the background: we have a numbers of prototype boards to run, with a QFP144 0.5mm pitch component. Unfortunately the foot-print is for a QFP144 0.65mm pitch. Does anyone know if there is a socket converter on the market for this; QFP144
Electronics Forum | Mon Sep 29 12:31:51 EDT 2008 | omid_juve
Thanks but we have QFP208 package here that after the reflow soldering during to the bad coplanarity of these devices some pads doesn`t have enough solder or not soldered. so we decided to use a qfp nozzle that can be placed on a QFP pads and use a
Electronics Forum | Sat Nov 06 14:39:50 EST 1999 | Gary Moravchik
I am seeking sources of reliability and thermal stress data that compares BGA (50mil ball pitch) to QFP (20mil lead pitch)packaging for automative applications. Substrate material is epoxy glass. The ultimate goal is to collect sufficient data to hel
Electronics Forum | Tue May 25 12:59:37 EDT 2004 | gregp
Mils to MM is actaully English to metric. 1 mil is equal to 1 thousandth of an inch (0.001")or 0.0254mm so... 12mil pitch qfp is 0.012" or 0.3mm 15mil pitch qfp is 0.015" or 0.4mm 20mil pitch qfp is 0.020" or 0.5mm (Numbers are rounded)
Electronics Forum | Thu Jun 16 00:24:29 EDT 2005 | mskler
Hi everybody, Can some body tell me that what stencil thicknes is required for the 16mil QFP. I am getting bridging as well as dry at QFP pins. What type of solder 1. Viscocity 2. mesh size 3. flux contents Should be used for this type
Electronics Forum | Thu Aug 18 17:00:26 EDT 2005 | MM
We recently had some boards returned that have me stumped. Word was QFP pins were coming out of the solder in the field. Upon inspection it was true!! If you press gently on the pins they SLIDE out of the joint. The joints look good, shiny ect but it
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