Electronics Forum | Fri Jul 09 19:20:49 EDT 2010 | rway
This table, is it in a database? And is it indicating the number of component, solder insp. etc based on one board or one panel? It needs to be based on the total number of inspection on your panelized pcb. The equation works, you may just be look
Electronics Forum | Mon Mar 26 19:22:22 EDT 2018 | tey422
First of all, shouldn't allow SMT operators to edit/create recipes, only grant access to the well-trained only. You will put yourself at risk if you don't have good process rule of oven recipes. Newer oven models should come with software that has m
Electronics Forum | Wed Jun 20 11:44:19 EDT 2001 | Steve
We use a universal recipe for 90% of our products. But, I had to develop a temperature profile for each PCB to know that I was getting the correct temperature at the PCB. You may need to work a weekend or a couple of late nights to get the data. Go
Electronics Forum | Wed Feb 02 11:49:18 EST 2000 | Greg Jones
HJ: We presented a paper on how to accomplish this at Nepcon 99: Reducing Oven Changeover Time by Finding Common Recipes for Mixed Production Lines It is available at: www.kicthermal.com/library/index.html Good Luck, Greg
Electronics Forum | Wed May 19 10:26:46 EDT 1999 | Jan Freier
Does anyone know of an existing or 'in the works, soon to be released' product for converting GenCam files to the SMEMA Standard Recipe File Format? Any help deeply appreciated. jfreier
Electronics Forum | Mon Jan 11 15:20:29 EST 1999 | Chrys
| I have an Electrovert UPK 660c fitted with IR preheats top and bottom. We assemble a large range of multilayer backplanes and I was wondering if there are any advantages in changing to convection preheats.Has anybody got any views on the subject.
Electronics Forum | Thu Aug 22 22:09:05 EDT 2002 | davef
Determine the number points (parts) on a pc board to be measured/connected in temperature profile according to the purpose of the profile. For instance: * A thread here on SMTnet recently discussed �copper plate� profiling. It is used primarily for
Electronics Forum | Tue Sep 10 08:22:36 EDT 2002 | davef
I doubt that the interposer is FR4, it's more likely to be BT. Warp during reflow is a function of material a reflow recipe. Your ramp is too fast and is causing the interposer to bend like a potato chip.
Electronics Forum | Tue Oct 22 20:37:09 EDT 2002 | davef
Pd takes longer to desolve than the materials yer used to using. Search the fine SMTnet Archives for background on modifying your reflow recipe.
Electronics Forum | Tue Jul 15 10:01:15 EDT 2003 | davef
We don't use Sn50, but if we did, we'd use our paste supplier's recommendation as the starting point for developing our reflow recipe.
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