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Viscom to Exhibit 3-D SPI Unit with SPI-AOI Uplink at the IPC APEX Expo

Industry News | 2012-01-19 23:09:10.0

Viscom proudly announces that it will exhibit its recently introduced 3-D SPI system in Booth #2629 at the upcoming IPC APEX Expo. The system is now available with the unique SPI-AOI Uplink feature that provides better defect detection during post-reflow AOI, ensuring the lowest false alarm rates.

Viscom AG

Inline Automatic Optical AOI

Inline Automatic Optical AOI

New Equipment | Test Equipment

Inline Automatic Optical AOI For post print, pre reflow, mixed mode and post reflow applications Leading the Way for Inspection Solutions RISON products, can effectively control the various processes, find the solder paste printing, compo

Shenzhen rison automatic co.,ltd

VT-S730 Post Reflow 3D AOI

VT-S730 Post Reflow 3D AOI

New Equipment | Inspection

The VT-S730 is a High Quality Inspection system, meeting the needs of all SMT Processes. 3D-SJI: Unique COMBO patented technology RGB/Phase Shift IPC standard compliance in full real 3D Telecentric Camera Lens Multi-Angled, Oblique Cameras Use

Omron Inspection Systems

Horizon Stannatech - Immersion Tin System

Horizon Stannatech - Immersion Tin System

New Equipment | Assembly Services

Perfectly Controlled Immersion Tin System The Horizon Stannatech system is the leading immersion tin system within the entire PCB industry. Together with the Stannatech process and Atotech's unique Crystallizer and ConStannic control systems for im

Atotech

ScanINSPECT BGA Inspection System

ScanINSPECT BGA Inspection System

New Equipment | Inspection

ScanINSPECT BGA provides a fast, simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, yet slow, measurement systems. ScanINSPECT BGA uses an intuitive process flow interface integrated with a

ScanCAD International, Inc.

Samsung Pick and Place Machine EXCEN PRO China Supplier

Samsung Pick and Place Machine EXCEN PRO China Supplier

New Equipment | Soldering - Other

Samsung Pick and Place Machine EXCEN PRO China Supplier High Speed:120,000 CPH Ultra Slim Design with a Total Length of 1.25m Applies High Rotary Modular Head Side-view Vision System Product description: Samsung Pick and Place Machine EXCEN PR

Flason Electronic Co.,limited

Flason SMT Samsung Pick and Place Machine EXCEN PRO China Supplier

Flason SMT Samsung Pick and Place Machine EXCEN PRO China Supplier

New Equipment | Pick & Place

Flason SMT Samsung Pick and Place Machine EXCEN PRO China Supplier High Speed:120,000 CPH Ultra Slim Design with a Total Length of 1.25m Applies High Rotary Modular Head Side-view Vision System Product description: Samsung Pick and Place Mach

Flason Electronic Co.,limited

Samsung EXCEN PRO High Speed SMT Modular Chip Mounter

Samsung EXCEN PRO High Speed SMT Modular Chip Mounter

New Equipment | Soldering - Other

Pick and Place Machine Samsung EXCEN PRO High Speed SMT Modular Chip Mounter High Speed:120,000 CPH Ultra Slim Design with a Total Length of 1.25m Applies High Rotary Modular Head Side-view Vision System Product description: Samsun

Flason Electronic Co.,limited

Sinic-Tek  High-Speed Desktop AOI T520

Sinic-Tek High-Speed Desktop AOI T520

New Equipment | Inspection

Product Features:   1. Original DISP Technology (Dynamic multi-frame Images Seamless Patchwork)    It has renovated the traditional way which industry operates, and firstly has achieved dynamic seamless patchwork of multi-frame Images of the entire

ShenZhen Sinic-Tek Vision Technology Limited

Sinic-Tek  High-Speed Inline AOI S520

Sinic-Tek High-Speed Inline AOI S520

New Equipment | Inspection

Product Features:   1. Original DISP Technology (Dynamic multi-frame Images Seamless Patchwork)    It has renovated the traditional way which industry operates, and firstly has achieved dynamic seamless patchwork of multi-frame Images of the entire

ShenZhen Sinic-Tek Vision Technology Limited


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