Electronics Forum | Thu Jun 24 09:24:03 EDT 2004 | Rob
The smallest component we use is 0402. Solder paste is Kester 256. Printer is MPM Ultraprint 2000. Stencil is 6 mil. I didn't here anything bad (rework or whatnots) in terms of soldering of those components.
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Tue Sep 18 18:36:59 EDT 2001 | mparker
... and don't forget proper stencil alignment. Invariably I find most bridging problems for fine pitch parts, etc. is caused by lousy alignment. The alignment must be verified under magnification, using the naked eye is not good enough. Use at least
Electronics Forum | Sat Apr 27 09:47:27 EDT 2019 | SMTA-Joe
Hello SMTA, We currently use Solder Stencils for installation/rework of QFNs/BTCs, and have tremendous success with them. While they aren't overly expensive considering their high quality it does seem like a waste of money to purchase more screens
Electronics Forum | Sun Mar 24 23:11:36 EST 2002 | sy_koh
I am looking technology for BCC package. The preliminary datasheet from customer show that it had rectangular flat pad on the joint. The smallest pitch is 0.6mm having 96 I/Os. I am currently putting BGA, uBGA, CSP and CBGA onto PCBs usinf no-clean
Electronics Forum | Thu Jan 18 05:37:24 EST 2007 | HC
Wondering if anyone is using cleaning solutions that are safe to use and store, and don't cost an arm and a leg. Cleaning tasks would include solder paste stencil cleaning, misprinted PCB cleaning, flux cleaning after rework, and so on and so forth.
Electronics Forum | Fri Jan 14 16:21:42 EST 2000 | Dave Chapman
We are having mid chip solder balls on chips and resistors. Seeing the problem on 80% of the assemblies we run. Anywhere from 1 to six of the balls per board. We have slowed the oven down, increased the pressure on the screenprinter to get less paste
Electronics Forum | Wed Apr 28 14:41:45 EDT 1999 | Bob Willis
| | What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | | | Thanks, | | | | Frank | | | Frank, | Refer to the device manufacturers. they are going t
Electronics Forum | Wed Aug 26 12:06:44 EDT 2009 | clampron
Good Morning, I have been struggling with this part for some time now. I have to agree that whoever designed this part, did not have to manufacture with it. We have advanced to a point where they have a acceptable yield but I believe that will be hi
Electronics Forum | Thu Jul 23 13:11:13 EDT 1998 | Gestapo Allen
I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the rew
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