Full Site - : secondary cure dymax (Page 6 of 8)

Conformal over No-Clean

Electronics Forum | Fri Apr 26 10:42:28 EDT 2002 | Jim M.

I worked for a telecom company that had sites in the deserts, jungles, mountains and regular built up area's. All boards were built using Aim 291/293 No clean solder paste. (all boards built to Bellcore standard) The boards were coated with Dymax ur

Solder balls on Cleaned process

Electronics Forum | Wed Oct 17 17:43:27 EDT 2001 | davef

2) Open time: A 15-minute queue between paste, place, and reflow SB fine, assuming humidity is not too great. 3) Wash temperature: Yes. A wash temperature of 130-140�F SB fine. 4) Reflowed board was left too long prior wash: Are you washing: * After

Re: Bottomside smt falling off in wave in only voc-free flux

Electronics Forum | Tue Jun 15 12:03:27 EDT 1999 | Dave F

| Has anyone had issues where bottomside double reflowed smt has fallen off in the wave when using voc-free flux? I have verified the hotter profile was not the issue by using an alcohol based flux with no problems.This voc-free flux is also not caus

Re: Cure/Reflow Profile

Electronics Forum | Wed Feb 23 00:16:23 EST 2000 | Finepitch Services

Sal, Jax has a good point about utilizing your multi-profile oven and switching to a different profile. However, since some ovens cause trouble while cooling off and stabilizing, I will assume you do have to use the same profile for whatever reason.

Re: Cure/Reflow Profile

Electronics Forum | Wed Feb 23 00:16:23 EST 2000 | Finepitch Services

Sal, Jax has a good point about utilizing your multi-profile oven and switching to a different profile. However, since some ovens cause trouble while cooling off and stabilizing, I will assume you do have to use the same profile for whatever reason.

Re: AR vs. UR

Electronics Forum | Mon Mar 29 04:36:49 EST 1999 | Graham Naisbitt

Just for the record folks, The customer I believe may be manufacturing stuff for refuelling rigs of various forms. This being the case, the coating would need to be resistant against fuels and oils. The UR material (at least ours!) is able to resi

Re: AR vs. UR

Electronics Forum | Mon Mar 29 19:17:47 EST 1999 | Scott McKee

How true, AR would not be the right choice... Scott | Just for the record folks, | | The customer I believe may be manufacturing stuff for refuelling rigs of various forms. | | This being the case, the coating would need to be resistant against f

Solder flow thru via on pad

Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef

Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the

Re: reliability of epoxy

Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach

| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the

Re: AR vs. UR

Electronics Forum | Fri Mar 26 12:59:51 EST 1999 | Scott McKee

| | I am looking into replacing another business division's Acrylic coating process with our Urethane coating process. Unfortunately, MIL-I-46068 doesn't differentiate AR/UR's performance, and the MFR data sheets don't match up at all (they each spe


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