Electronics Forum | Tue Mar 21 12:52:56 EDT 2017 | emeto
No clean is giving us problem in ICT. Other than that, a coating of flux should remain there to pretect the solder joint from the environment. In general you should not clean NO clean - it is supposed to be there.
Electronics Forum | Wed Jan 12 10:15:43 EST 2005 | davef
We conformal coat our boards and get pretty good coverage along the edges of BGA. If you need coverage along the edges and are not getting it, your supplier may be able to recommend a different material or application method. Most often, underfill
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Mon Oct 18 09:41:56 EDT 1999 | Wolfgang Busko
That should not happen. There are some threads concerning BGA and wavesoldering you could look for. It�s said that you should protect the vias in the BGA-area by soldermask or at least with tented vias to prevent rereflow of BGAs solderjoints what co
Electronics Forum | Wed Jan 29 16:59:36 EST 2003 | Stephen
If you are buying form a good rep they should be able to give you all the information you need. I've found good reps have the info you need and actually enjoy helping. And sometimes reps for alternate products will help as well, hoping you will swi
Electronics Forum | Thu Feb 25 14:06:56 EST 2010 | CL
Good Afternoon Duane, Surface tension should be adequate to hold the smaller BGA's during second side reflow. You will need to ensure that nothing comes in contact with the parts during reflow. I have added a chipbonder adheasive at the edge of some
Electronics Forum | Thu Jan 13 15:19:51 EST 2000 | Dave F
Hey Jack: It's certainly "do-able." Conformal coating adhesion testing was done as part of the "Evaluation of Low Residue Soldering for Military and Commercial Applications: A Report from the Low Residue Soldering Task Force," published by Sandia Na
Electronics Forum | Wed May 29 14:24:51 EDT 2002 | caldon
Stick with round aperatures they work fine. If you are successfully processing fine pitch QFP's then switching to BGA's should be no problem. Profiling is a little tricky, a thermal couple should be mounted at the under/ center of the component. cal
Electronics Forum | Mon May 10 15:17:37 EDT 1999 | C.K.
| If I clean my assembly and find no visable contamination with the unaided eye, do I need to do cleanliness testing prior to conformal coating? | More than likely, you're okay if you can't see any contamination with the unaided eye. However, the
winsouce.jpg)