Electronics Forum | Tue Apr 20 19:34:13 EDT 2004 | Ken
ImAg is the Surface finish of choice for Intel mother boards....Tin/lead and lead free processes. I think palladium and soft gold are the preferred for wire bondable apps.
Electronics Forum | Sat Jul 31 08:14:43 EDT 2004 | sforman1
Your liquidus time is too long. 63/37 is a eutectic so leave at liquid state a very short time SF
Electronics Forum | Tue Aug 24 14:01:12 EDT 2004 | davef
Indy: How is this situation different than the last time you posted: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=29371
Electronics Forum | Thu Feb 24 08:29:01 EST 2005 | davef
We have done some work with conductive adhesives. The main lesson is: They do not adhere well to solder. * For components, a silver-palladium or gold end termination is recommended. * For substrates, gold over nickel should work well.
Electronics Forum | Mon Feb 18 07:57:38 EST 2008 | davef
Silver palladium is intended for adhesive applications. You need components with a nickel barrier. While you're waiting for others to reply, search the fine SMTnet Archives [ar and pd] to find postings like http://www.smtnet.com/forums/Index.cfm?CFAp
Electronics Forum | Fri May 28 16:30:39 EDT 1999 | JohnW
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Thu Feb 24 10:34:02 EST 2005 | Rob
Thanks Dave, From what I remember a lot of components went away from Silver Palladium to "base metal" terminations because of the difficulties in continuation of supply & stability of price. (Something about being mined in Chechnia or the Congo?) W
Electronics Forum | Sun May 02 18:52:36 EDT 1999 | JohnW
| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi
Electronics Forum | Sat Mar 25 07:23:05 EST 2006 | davef
Rob It's documented that lead doesn't leach out of landfills. So, how does Eurolanders health become affected by lead in landfilled electronic products? Isn't the potential for lead poisioning from using leaded glass greater a danger? Given that
Electronics Forum | Thu Feb 19 12:35:13 EST 1998 | Earl Moon
| | We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interest
