Electronics Forum | Thu Aug 22 16:25:18 EDT 2019 | scotceltic
Yes, unfortunately a lot of datasheets these days do not contain the temperature resistance to determine if it can handle the PIP application. In the past I have always used a 250 C at a min of 5 sec for the material. Also, the part should have sta
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Mon Aug 12 18:26:05 EDT 2002 | pjc
If you are talking actual placement rate- from first fiducial read of board no. 1 to first fiducial read of board no. 2, here is the best I've ever seen based on the boards I've run: CP3- 141 seconds for 468 components per board (all rectangular chi
Electronics Forum | Fri Jul 08 09:40:28 EDT 2005 | Jason Fullerton
"The only real problem we're seeing is some suppliers trying to use bismuth. That's a big no-no in a SnPb process and we won't accept those parts." Yes and no. Since the SnPbBi tertiary alloy melts at 96 degC, any product rated for storage above tha
Electronics Forum | Tue Jan 03 03:01:35 EST 2006 | Frank
The 740 and 760 basically have the same specs as far as component ranges: 0402-50mm components. The 760 is a bit more accurate and the vision system is better. The 740 was designed when BGA weren't really around and so it can barely vision center b
Electronics Forum | Thu May 25 11:31:52 EDT 2006 | muse95
Patrick, I believe you are mistaken about this being a myth. Many component manufacturers changed more than plating to make their component withstand higher temps. Some changed mold compounds, others changed plastic types used. Many of these change
Electronics Forum | Sat Jul 19 12:22:55 EDT 2008 | operator
Are there any softwares OR functions inside of the softwares that allow a designer that is creating a very large complicated wiring diagram with say....many terminal blocks and connectors etc... to run a point to point check on his drawing? Bascially
Electronics Forum | Sun Nov 06 19:20:23 EST 2011 | jeffr
Tom, Does this only happen on one job or all jobs ? If this happens again..you should clear the RAM memory, but changing the 10 year 3v lithium battery on the motherboard should also be considered at the same time. RAM CLEAR PROCEDURE: Power off, rem
Electronics Forum | Wed Sep 26 10:05:41 EDT 2012 | testbloke
Although we do not have any soldering issues with our OSP PCB's, I am trying to establish clear rules with regards pcb storage and shelf life. Our PCB's are supplied in metalised moisture barrier bags but without desicant, our current rules as follow
Electronics Forum | Thu Jul 15 10:28:49 EDT 1999 | Boca
| I'm looking into vision inspection equipment to automatically inspect SMD placement and solder joint quality. Does anyone have any recommendations or know of any commonly used equipment? Do other manufacturers use vision systems at their inspecti