Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F
MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a
Electronics Forum | Tue Apr 15 15:23:10 EDT 2003 | davem
I would agree with the advice given by previous poster's. "Buyer Beware" is the rule of the day. Especially when dealing with 3rd. party brokers. Keep an eye out for some of the teir 1 EMS corp's auctions. You can pick up some excellent deals on we
Electronics Forum | Sun Jun 07 02:06:26 EDT 1998 | Earl Moon
| Earl, | As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coor
Electronics Forum | Tue Sep 28 06:41:05 EDT 1999 | Earl Moon
| Dear Administrator, | | On 9/25, a forum user named Seli posted a question titled "Electronic Manufacturing on the Beach". Out of 11 responses to his posting, exactly one had anything to do with his question. The other 10 were completely off top
Electronics Forum | Tue Jan 17 05:02:33 EST 2006 | grantp
Hi, I was replying to this thread appearing suddenly. However I have run both machines, and I paid for them myself because I run my own company, and so the choices I made, I personally had to pay for. Also, anyone who's been on this forum for a whi
Electronics Forum | Thu Nov 30 16:10:05 EST 2006 | Hussman
Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001 (Chunks was there, but she failed to read the fine print). And almost all parts that measure G follow Note 3 which states "Properly wetted fillet s
Electronics Forum | Mon Dec 18 01:25:47 EST 2006 | seety1981
test engineer and product engineer... Hi all, Sorry if this topic is not suitable to be in this forum.. anyway,... i would like to know what the different of the jobs scope between the Test Process and Test Product engineer in semiconductor manufac
Electronics Forum | Wed Jul 05 11:44:04 EDT 2006 | Rob
We had one mechanical engineer from a certain customer telling us we had to crop components leads so they didn't protrude through the board, as they could then come in contact with the case as the board was flush. Had I have known then what I know
Electronics Forum | Wed Jul 05 16:26:51 EDT 2006 | flipit
I had one SMT process engineer using rubber bands to hold a connector on second side reflow. Even the operators told him he was nuts. The zero stick through on leaded devices has come up several times for me. We clip leads first and pin in paste t
Electronics Forum | Tue May 30 08:07:56 EDT 2000 | David Lazarus
I am a senior industrial engineering student at the University of South Florida. For my Facility Design class, my team has chosen to design a PCA plant that will make one product. We are looking for an obsolete or in-service circuit board assembly
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