Electronics Forum: solder and ball and gap (Page 6 of 19)

Selective soldering pallets and solder balls

Electronics Forum | Thu Dec 05 11:04:27 EST 2002 | slthomas

They're IR, bottom side only. Frankly wave solder is not my forte (there are those that would claim nothing is), but I've personally been tasked with developing a process to do reliable, high volume bottom side SMT, so I'm drawing a lot from the tec

Selective soldering pallets and solder balls

Electronics Forum | Tue Dec 03 18:31:45 EST 2002 | slthomas

At the price of Durapol we'd never get the OK to have them made. The Al fixtures are cheap and a quick turn local item. As dense as the pth parts are I also don't think there'd be any room for any holes which I really think is the answer as far a

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 09:21:58 EST 2006 | Michael Sanders

Is anyone aware of any articles, white papers, etc., that discuss the gap between the lead and the pad after a SM joint is soldered? In particular, I am looking for a formula for that "gap" for various components.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 09:37:39 EST 2006 | GS

Have you seen IPC-A-610 D ? regards GS

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 15:41:51 EST 2006 | realchunks

Try IPC-SM-782.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 20:12:41 EST 2006 | davef

We don't have a gap between the lead and the pad after a SM joint is soldered. On our boards, this space is filled with the solder intended to attach the component to the board. How high do components sit above the surface of a board? Most people a

Stencil Bleed - Bridges and Solder Balls

Electronics Forum | Mon Aug 14 05:45:16 EDT 2023 | dimamalin

First, this is the result of bad printer setup. Adjust knife pressure, PCB gap, separation speed, tooling, and stencil cleaning. Pay attention to the coating of contacts pad and height of solder mask of PCB.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas

IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 20:30:22 EST 2006 | davef

Your customer is so poorly educated that you should decline their work, because this will not be the last time they waste your time with their cockamamey theories.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 14:49:54 EST 2006 | M. Sanders

Dave, Thanks - I couldn't agree with you more. Unfortunately, our "bean counters" have a different frame of mind.


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