Used SMT Equipment | Soldering - Reflow
T300 Conveyor Hot-air Reflow Oven Conveyor Hot-air Reflow Oven has (3) heating zones and (300mm) wide and (1200mm) long conveyor for low to medium volume production runs. T300 utilizes PID intelligent micro-computer automatic temperature cont
Used SMT Equipment | Soldering - Reflow
The 1809 modes support high mix / high volume throughput... at speeds up to 32 inches (80 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardl
Used SMT Equipment | SPI / Solder Paste Inspection
Vi Technology 3D SPI 3D Solder Paste Inspection System Model: 4000L 3D SPI Year: 2009 Accuracy and warp compensation Unmatched true resolution, accuracy and repeatability Full-featured absolute measurement of the full board surface, mapping to
Used SMT Equipment | Soldering - Selective
Max PCB or pallet size 310 x 410 mmMax PCB weight 10 kgSolder pot volume MW 180 kg / SW 45 kgMax soldering area 250 x 350 mmN2 consumption 75 L/minMaximum components height top side 120 mmPower supply 3 x 400V 50/60 HzCjhmhbg00wMachine size (L x W x
Used SMT Equipment | Soldering Equipment/Fluxes
Air-Vac Solder Reflow System, Model: PCBRM System 5.2, Includes footswitch Complete Capability for Low Volume Automated Selective Soldering of Through Hole Components Fume Extraction Manifold Option The PCBRM System 5.2 has all of the feature
Used SMT Equipment | Soldering Equipment/Fluxes
Air-Vac Solder Reflow System, Model: PCBRM System 5.2, Includes footswitch Complete Capability for Low Volume Automated Selective Soldering of Through Hole Components Fume Extraction Manifold Option The PCBRM System 5.2 has all of the feature
Used SMT Equipment | Soldering - Reflow
Heller 1088HAC 4-zone computer controlled convection reflow oven w/ mesh belt, PC, manuals and some frames for double sided boards and spare parts are included. Unit was used lightly in PB free environment. Would be ideal for a area that needs sm
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Used SMT Equipment | Soldering - Reflow
Air Operation 8 Top Heating Zones 8 Bottom Heating Zones 1 Cooling Zone PCB Flow: Left-to-Right Edge Rail & Mesh Rail The workhorses, these consistent performers have proven themselves in thousands of high volume lines worldwide in 6 sigma env
Used SMT Equipment | Soldering - Reflow
SMT460C Reflow Oven Fresh out of Low Volume Lead Free Production Edge Pin Chain Conveyor and retractable center board support YOM 1999 Left To Right Ready Now Just serviced with new filters Max. Current consumption per phase (5 Heating Modules)
Used SMT Equipment | SPI / Solder Paste Inspection
Agilent SP50 Series II 3D SPI 3D Solder Paste Inspection System Model: SP50 Series II Vintage: 2006 Maximum board size: 510 by 510 mm (20 by 20 in) Minimum board size: 50 by 50 mm (1.97 by 1.97 in) Maximum board thickness: 4 mm (0.16 in) 2D an
