Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam
| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run
Electronics Forum | Fri May 30 20:03:14 EDT 2014 | hegemon
Starting with the manufacturers layout is a good start. Tilted parts, bad solder joints, sounds like a wetting issue and the board or the parts. Insufficient solder sounds like the printing process needs some attention. We have used this part in th
Electronics Forum | Thu Oct 01 12:33:38 EDT 2015 | gregoryyork
Happy to help please do not hesitate to contact us we will send one of our Engineers in if need be. We also do a Solder Paste heat stable to 50C for non refrigerated use. BLT Circuit Services Ltd
Electronics Forum | Sat Oct 24 13:03:20 EDT 2015 | mikekeens
With regards to PCB surface finish I would recommend Electroless Nickel Immersion Gold (ENIG) because of the long shelf life, tarnish resistance, RoHS-compliance, and easy soldering compared to other surface finishes. http://www.surfacemountprocess.
Electronics Forum | Mon Oct 04 04:01:10 EDT 1999 | Chris May
| What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | How about curing bottom side first and reflowing top side later? | | What percentage of companies run reflow/cur
Electronics Forum | Thu Oct 05 15:41:36 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon. From what it sounds like is that the solder joins are not getting hot enough or if it Au, then the increase in the Au content of the joint is increasing the melting point of the final solder joint. To some extent, this will also hap
Electronics Forum | Sun Jul 26 07:09:25 EDT 2015 | orbitcoms
Thank you for your prompt response. The boards we have made for us current are Immersed Gold treated because we have been hand soldering and needed flat finish that would solder ok without tarnishing too quickly. I will take a look at the link you pr
Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH
Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,
Electronics Forum | Tue Nov 27 20:32:38 EST 2001 | davef
Stress is meaningful if it affects the long term reliability in a product's end-use environment. I don�t believe that things are that straight forward, although it would be nice if they were. Consider that differences in materials, number of layers
Electronics Forum | Wed Jun 04 21:11:11 EDT 2014 | isd_jwendell
This style gave me grief as well. The problem is the way the part is manufactured leading to an unusual pad configuration. When the part is placed on the PCB there is no pad wrap under the part, the pad is 90 degrees to the board. The datasheet shows
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