Electronics Forum: solder joint reliability (Page 6 of 370)

Re: solder joint problem?

Electronics Forum | Wed Jun 14 08:08:56 EDT 2000 | Wolfgang Busko

Hi ji tae, we had a similar problem with QFPs 0,5 pitch processed by one subcontractor. The symptoms we noticed were: - the solderjointshape and wetting looked normal - the surface had a dull gray appearance - by pushing a lead sideways with a tweez

Re: Insufficient solder joint

Electronics Forum | Tue Dec 14 11:08:59 EST 1999 | Wolfgang Busko

Hi Paul, you got to find the reason first before any measures can be taken. You have to determine wether it happend somehow at your site or at the boardhouse, you can�t blame them without reason. As long as it is suspected that more of those panels

Re: Insufficient solder joint

Electronics Forum | Tue Dec 14 11:13:43 EST 1999 | Chris May

Paul, I have (as many have) come across this problem due to misregistration of resist at the PCB fab. You didn't say if these boards are inexpensive double sided or costly multis. I know this shouldn't make a difference on quality but I would tend t

ENIG; Au < 0.5 um to avoid solder joint embrittlement

Electronics Forum | Wed Jun 08 23:04:26 EDT 2022 | SMTA-64387544

Au thickness of 0.125 um should not cause solder joint embrittlement. Also, PCB fab should offer Au thickness range between 0.05-0.075 um for better process control and reliability. Higher Au thickness may suggest black pads leading to solder joints

Re: qfp and soic joint Problem

Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F

Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:

SMT soldering reliability life (BGA)

Electronics Forum | Mon Sep 27 12:06:59 EDT 2004 | Peppe

Hi, I work in telecom area and I'm looking for an answer about the reliability of BGA soldering and also the value of Activation Energy for the BGA soldered on PCB, to be used in Arrhenius acceleration model. Please could help ? Many thanks in advan

SMT soldering reliability life (BGA)

Electronics Forum | Wed Sep 29 08:26:34 EDT 2004 | davef

What's your email?

SMT soldering reliability life (BGA)

Electronics Forum | Wed Sep 29 08:47:55 EDT 2004 | Peppe

Davef, my email is : peppe_ten@libero.it Regards, Peppe

Re: BGA ball size reliability

Electronics Forum | Wed May 12 20:32:14 EDT 1999 | Earl Moon

| Earl | | you posted a message on 1-14-99 about converting to VOC free flux. Have you completed your evaluation? Could I get a copy of any data supporting your conversion to VOC free? | | Thanks | | WDR | | WDR, We are awaiting the latest dat

bulbous joint

Electronics Forum | Fri Feb 20 08:44:05 EST 2004 | davef

Lucky guess, eh? [Sorry to blow your theory on bad parts] A 1000 of these boards on the line, ummm. Two ideas to consider: * Increase the conveyor angle [don't get carried away, just keep the angle below 8*]. * Balance the flow of solder so that th


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