Electronics Forum | Tue Jan 31 21:15:52 EST 2017 | davef
Dispensing: You can dispense for 0201 and above Warped laminates: Ask your laminate fabricator what's ausing the warping and how to make it go away
Electronics Forum | Tue Jan 31 08:59:24 EST 2017 | rob
Hi Joshua, We ran 150K per week this way, you just need a lot of pallets. Regarding dispensing I've seen 0201 (Imperial)paste dispensed, so about 0.4ish mm dots. I'm sure the Mydata printer is also pretty high resolution too, but not too quick.
Electronics Forum | Wed Feb 01 02:11:38 EST 2017 | Rob
Hi Joshua, No, the adhesive lasts 2 or 3 runs. The adhesive is put on manually as is the kapton. It's a big panel for a flex - nearly 300 x 210, so the operator loading the boards onto the pallet and fixing them (then into a buffer) stays well ahe
Electronics Forum | Thu Jan 26 02:14:52 EST 2017 | jgo
Hi all, Am new to SMT here. I have a very thin laminate substrate which around 120um thickess. Being that thin, warpage is constantly an issue for us. For the solder printing part, we have a number of problems. Being so thin and warped, we need t
Electronics Forum | Mon Jan 30 05:58:39 EST 2017 | rob
Hi all, > > Am new to SMT here. > > I have a very > thin laminate substrate which around 120um > thickess. Being that thin, warpage is constantly > an issue for us. > > For the solder printing part, > we have a number of problems. > > Being s
Electronics Forum | Fri Jan 19 14:34:37 EST 2007 | Al Coholic
Add solder.
Electronics Forum | Tue Jan 16 07:22:21 EST 2007 | adamp
We are using composite pallets for our boards. Regards Adam
Electronics Forum | Mon Jan 22 02:23:47 EST 2007 | adamp
Thx guys, I'll check everything you mentioned, including solder pot, and solder feeder sensors.
Electronics Forum | Mon Jan 15 18:20:11 EST 2007 | greg york
are you using composite pallets in the wave or oil/wax around the pump impellar? cheers greg
Electronics Forum | Tue Jan 16 07:17:20 EST 2007 | adamp
I have checked pot temperature in different parts of solder pot and it looks like it is correct (250C). I have also lowered solder pot temperature and removed copper from the surface of the solder pot (operation repeated couple times). There is still
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