Industry News | 2009-12-10 01:05:59.0
Building on its successful lead-free solder products portfolio, Henkel has developed Multicore LF730, a Pb-free solder paste born from the company’s unyielding innovation commitment and arguably setting the benchmark for lead-free paste performance.
Industry News | 2008-11-12 15:02:58.0
DENVER, Colorado � November 2008 � Krayden, Inc. and Kraydenmex, leading distributors of engineered materials, announces that they have partnered with Henkel Corporation as a full line distributor of Henkel's leading electronics materials brands including Loctite� Hysol�, Multicore�, and Emerson & Cuming.
Industry News | 2010-03-24 14:52:55.0
ZURICH, Switzerland, - DEK International GmbH. has been recognized as one of 10 suppliers to receive Intel Corporation's prestigious Supplier Continuous Quality Improvement (SCQI) award. The award recognizes extraordinary commitment to quality and exceptional performance to Intel's goals and is the company's highest honor for its suppliers. In 2009 DEK provided solder paste and flux printing equipment deemed vital to Intel's success.
Industry News | 2012-03-28 21:08:39.0
Manncorp's new "Production Runner" turnkey PCB production line is designed to meet the needs of high-mix, low-to-mid-volume automated assembly and is equally suitable for both short and long runs. The line includes Manncorp’s acclaimed dual-head 8,000 cph MC-385V2V pick and place, the 5500 dual squeegee stencil printer and the CR-4000C lead-free hot air convection reflow system.
Industry News | 2023-03-16 14:54:24.0
Located in County Armagh, Northern Ireland, contract manufacturer Lenalea Electronics Ltd has been using 2D Automatic Inspection System technology for almost a decade and has now invested in the latest 3D AOI from Europlacer to support its expansion plans.
Industry News | 2023-03-16 15:05:44.0
Located in County Armagh, Northern Ireland, contract manufacturer Lenalea Electronics Ltd has been using 2D Automatic Inspection System technology for almost a decade and has now invested in the latest 3D AOI from Europlacer to support its expansion plans.
Industry News | 2008-04-17 16:46:07.0
In what is truly a ground breaking material advance, Henkel Corporation has developed a new reflow cured encapsulant material that combines flux functionality and underfill protection into a single material. The breakthough product, Hysol� FF6000�, is a reflow curable material that is formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress.
Industry News | 2010-04-23 21:21:38.0
Never content to rest on the laurels of its proven lead-free success, Henkel has developed and launched Multicore LF620: a new lead-free solder paste that effectively delivers on a broad range of demanding requirements, essentially offering a lead-free paste that has it all.
Industry News | 2009-04-09 22:35:29.0
The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever.
Industry News | 2009-11-24 22:07:52.0
Henkel’s in-depth materials development initiatives surrounding halogen-free innovation has yielded another process-enabling product. Multicore HF108 is a lead-free, halogen-free solder paste that combines all of the benefits of robust lead-free materials with the advantage of no deliberately added halogen and is now commercially available.
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