Electronics Forum | Mon Feb 18 17:36:32 EST 2008 | kennyg
I should have mentioned... the only flux we use for the hand soldering is wire-core, no bottle flux. I think it should be a non-issue to leave the activated wire core flux residue. I'm just looking for some way to prove it to the designer.
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Mon Feb 18 17:27:13 EST 2008 | jdumont
If the hand soldering is done right and you use little to no extra flux (other than whats in the solder wire) you should be ok. You should still verify with some testing however... You need to make sure any flux used is activated, thus rendered benig
Electronics Forum | Tue Jan 08 11:28:30 EST 2002 | mregalia
We use NC flux exclusively for SMT and wave soldering. And it is a fairly old formula from Multicore, though we are currently qualifying a new formula. The automated soldering does not appear to be a problem. It is only the hand soldering that causes
Electronics Forum | Tue Feb 19 08:49:34 EST 2008 | rgduval
Get the ionic specs from your flux manufacturer, and show it to the designer. No-clean flux/solder is supposed to be low to minimal in ionic contamination, which allow the whole no-clean thing. If he needs further proof, you can have the board io
Electronics Forum | Wed Jul 28 11:47:16 EDT 2004 | GCronin
I am looking for a consistent method of applying no clean liquid flux to solder pads. My main concern is if I use a standard air-over type dispenser mounted to an automated arm that the liquid flux will make a mess and not be consistent. I'm not to
Electronics Forum | Tue Apr 18 08:51:31 EDT 2000 | David Chapman
I have heard that a drwaback to VOC free flux in the wave solder machine is the machine will rust. Is this guy for real? What do you know about drawbacks vs. benefits of VOC free? Thanks
Electronics Forum | Mon Jan 15 11:43:13 EST 2007 | fredericksr
celsius or fahrenheit? I am not entirely familiar with the deeper details of HASL, but 130F-140F is adequate to clean many of the water-soluble fluxes used for component soldering.
Electronics Forum | Tue Jan 08 17:29:20 EST 2002 | davef
Your research is on track. NC flux needs to reach activation temperature. Also, do not depend on the corrosion characteristics associated with the flux classification (ie, L1, L0, M1, M0, etc.), until the flux is activated by exposure to soldering
