Electronics Forum | Wed Feb 18 12:18:28 EST 2004 | babe
Sometimes this is related to oxidized paste or paste that has sat onthe board too long before reflow. However most likely this is related to your reflow process. either too slow or too fast of a reflow ramp rate. Heating up an assembly too quickly wi
Electronics Forum | Mon Oct 30 09:24:21 EST 2006 | ronalds
I have some problems in sufficient preheating the pcb's. They splatter on the mainwave, causing solderballing. Less flux causes problems with the fill of the through- holes. We use a Delta Wave with 3 preheat zones, the first two are calrods the thi
Electronics Forum | Wed Jan 31 05:23:37 EST 2007 | pbarton
Barry, We do not see much in the way of solder splatter or solder balling. We have removed some parts but in the process of doing so we remove any useful evidence really. Quite a lot of the solderable portion of the part is on the underside. Like
Electronics Forum | Tue Mar 31 08:11:51 EDT 2009 | davef
Solder ball formation can be a significant problem if the balls get trapped in the smaller spaces between ceramic chip carriers and substrates or possibly between the leads of small pitch leaded ICs. The solder balls also reduce the solder volume ava
Electronics Forum | Tue Mar 22 11:57:07 EDT 2011 | jercole
Make sure the paper is advancing correctly on > your stencil wiper. I have seen this cause major > issues. If the paper hangs up, it will smear > paste across the bottom of the stencil every time > it wipes. We are manually cleaning the stenci
Electronics Forum | Fri Apr 08 15:27:05 EDT 2011 | stimpk
A couple more things to look at. ( DEK) Check you wiper blades. This is the rubber blade that holds the paper in contact with your stencil. When these wear down it will not clean properly. Also make sure when you run this product that you verify that
Electronics Forum | Fri Jul 06 10:45:02 EDT 2012 | ashworth14
In relation to question 2 the vacume on them is quite sensitive so as long as you bring it down slowly the component is almost sucked up off the PCB so you don't have to actually press it down on the the component, and i have never experienced any so
Electronics Forum | Wed Feb 03 15:29:33 EST 2016 | sarason
Have you ever done QC type thinking on your problem or are you aware o fthe methodology? Do you run your plant in a clean room environment? Do you clean after reflow? If not Why? What sort of products are you running? What sort of oven are we ta
Electronics Forum | Fri Feb 05 09:13:13 EST 2016 | emeto
Hello Greg, there are several things to be considered: I will start this investigation in the oven. Look in your cooling zones. Many ovens build up a lot of flux there(especially the ones with water cooling) and should be cleaned every so often.
Electronics Forum | Wed Feb 03 11:31:20 EST 2016 | steprog
Hi, New to this forum. I am an engineer assigned to resolve a quality issue on our production line. It seems that we have been getting small droplets of flux on our boards after the reflow process. Occasionally, they land on a board to board conne
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