Industry News | 2015-08-16 09:43:18.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.
Industry News | 2018-07-10 20:52:09.0
High density interconnect (HDI) technology makes it possible to place more components on both sides of a raw PCB and from a design perspective, HDI technology requires different setup and thought as to what is needed and how to accomplish it. As a result, designers need to understand the structure of the HDI traces and vias, and what their options and effects are to the cost and electronics involved.
Industry News | 2019-04-30 17:39:40.0
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor an amazing Chapter Tutorial Program. The tutorial will be held on June 11 and showcase the latest technologies, designs and reliability trends.
Industry News | 2020-03-08 16:49:19.0
IPC announces the release of five newly revised standards covering several areas of the supply chain, IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies; IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards; IPC-2591-Version 1.1, Connected Factory Exchange (CFX); IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements; and IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2021-02-05 09:31:21.0
The SMTA is pleased to announce the Best Papers from SMTA International 2020. The winners were selected by members of the conference technical committee. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Industry News | 2022-05-18 12:24:25.0
Supply Chain Crisis: When will the Chip Shortage End? What is the solution? Supply Chain issues are prevalent, causing a supply crunch and resulting in cut production, delinquent delivery shortages, and loss of profit. Then there is offshore manufacturing, which poses a security threat as democracy is threatened across the globe. The 2021 National Defense Authorization Act (NDAA) has a call for action to translate American innovation into domestically manufacturable, market-ready technology to provide solutions to the current market threats.
Industry News | 2003-04-17 11:32:31.0
Taking place Sept. 28-Oct. 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2007-10-04 23:11:30.0
LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Industry News | 2010-09-13 15:26:59.0
IPC — Association Connecting Electronics Industries® will bring together some of the brightest minds in the electronics industry for three free technical sessions at Electronics Midwest. Held September 28–29, 2010, at the Donald E. Stephens Convention Center, in Rosemont, Ill., the sessions will provide answers and insights into the challenges in printed board fabrication and assembly technologies as well as manufacturing with sustainability in mind.
Industry News | 2011-02-24 21:39:40.0
The assembly of solar panels is very similar to the assembly of printed boards, making solar power a hot opportunity for electronics assemblers. A small but growing market, solar module production is projected to increase 273% from 2010 to 2014, according to iSuppli. Shedding some light on the rapidly advancing business of solar panel assembly, IPC will host the Solar Assembly and Solar Living Pavilion on the show floor at IPC APEX EXPO, April 12–14, 2011, in Las Vegas.
