Electronics Forum: stencil opening (Page 6 of 44)

Stencil Opening

Electronics Forum | Sun Feb 22 05:53:25 EST 1998 | Ron Lahat

Stencil Opening Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable

BGA connector

Electronics Forum | Mon Jun 27 21:28:15 EDT 2011 | samsim

It seems to be no solder paste release at certain stencil opening, you may need to enlarge the stencil opening. By the way what is the area ratio for the opening and how is the shape (round/square/diamond)?

Re: Stencil Opening

Electronics Forum | Mon Feb 23 15:10:02 EST 1998 | justin medernach

| Stencil Opening | Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable Ron, Use a six mil foil thickness for your stencil. Go one to one with your apert

Tombstoning issues!!!

Electronics Forum | Wed Apr 09 21:09:22 EDT 2008 | elias67

Is the stencil opening rectangular? Home Plate? What is the spacing between the pads on the stencil for the component?

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o

I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.

Re: Stencil Opening

Electronics Forum | Wed Feb 25 02:33:52 EST 1998 | Scott McKee

| | Stencil Opening | | Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable | Ron, | Use a six mil foil thickness for your stencil. Go one to one with yo

Components Solder Short

Electronics Forum | Mon Jul 24 08:30:25 EDT 2006 | nodlac

- Dirty stencil transfering paste from the stencil bottom. - Stencil opening (Pad Hole) to pad ratio incorrect - too large -misaligned stencil

CCGA

Electronics Forum | Sun Apr 03 00:40:35 EST 2005 | Dhanish

What is the recommended stencil aperture opening ,stencil thickness and aperture shape for CCGA?We are seeing high reject for Open solder joint.

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Fri Dec 01 14:11:24 EST 2017 | kojotssss

EMIL, The first stencil was with 4 squares. then there was a worse percentage. Changed to the circles. Is better, but still not perfect. Stencil thickness did not change. I added 2 types of stencil openings. Pictures of watch:

Filling via holes during the reflow process

Electronics Forum | Mon Mar 04 11:08:56 EST 2002 | Matt Kehoe

We have a customer that desires to have their via holes plugged with solder after assembly. Is it possible to add the via holes to the stencil and print paste into them and expect them to plug? If so, how much paste? One to one on the stencil opening


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