Electronics Forum | Wed Feb 24 14:26:24 EST 1999 | Dave F
| Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean so
Electronics Forum | Mon Mar 01 17:54:56 EST 1999 | MMurphy
| Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean so
Electronics Forum | Sun Mar 07 13:10:15 EST 1999 | Sam Sangani
| Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean so
Electronics Forum | Thu Feb 25 04:24:15 EST 1999 | Charles Stringer
| | Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean
Electronics Forum | Fri Jan 15 08:43:43 EST 1999 | Mike McM
Bernie, If the pads are for a chip component and only about a half a pad off without anything else in the misregistered area, go ahead and use the stencil as is. Surface tension of the solder at liquidus should cause it to wick back to the pad, even
Electronics Forum | Wed Oct 11 05:58:13 EDT 2023 | kojotssss
Hello all, I know there are very skilled guys. Can anyone suggest a stencil design to avoid component displacement during reflow to improve tension of surface forces and selfalignment? There are cases where the inductors are shifted. All parameters
Electronics Forum | Thu Sep 02 08:06:01 EDT 1999 | Wolfgang Busko
| | I'd like to know the advantages and disadvantages between the two. | | | | Thanks and regards, | | However, I really like aperture reduction best after running the experiment while using .006" thick foils as the practical limit. This really w
Electronics Forum | Wed Oct 11 13:40:20 EDT 2023 | proceng1
Agreed. Your "leads" are fairly small compared to the PAD area, so you leave your part lots of room to "stretch it's legs". One thing that I have trouble communicating to my operators is that placement does not have to be perfect, and neither does t
Electronics Forum | Tue Aug 06 21:40:53 EDT 2024 | zsoden
The specs I have are: UP2000 1168x1606mm Horizon 1340x1636
Electronics Forum | Thu Jun 22 12:50:13 EDT 2000 | JAX
Igmar, Although I agree with Chrys that square is good,( Better volumn ) his explanation is not entirely correct. Heres a little insert from automata: With square apertures, solder paste is deposited at the center of the aperture. The center release
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