Electronics Forum: stencil thickness (Page 6 of 91)

stencil cleaning

Electronics Forum | Mon Oct 17 11:16:09 EDT 2005 | slthomas

There are a lot of things that might affect your cleaning efficiency. Paste type (no clean or w/s?), cleaning chemistry, aperture aspect ratio (aperture width/stencil thickness), "linty" wipes, etc. Another thing you need to look at is the frequency

patchwork stencil

Electronics Forum | Wed Jun 22 18:52:56 EDT 2011 | semiconjt

tTo explain what I mean...sorry for my bad Engilsh... please find short " patchwork stencil" description from EPP Europe. http://www.epp-online.de/europe/-/article/16537487/15944614/Innovators-of-laser-processing-technology /art_co_INSTANCE_0000/max

stencil condition

Electronics Forum | Thu Jan 07 05:57:37 EST 1999 | Ken Mok

What kind of equipment are you using to gauge the thickness of your stencil after it's used for some months? How to determin the condition of the stencil? Your input is much appreciated. Ken Mok, based in Shenzhen, China.

0201 (0603) stencil spec

Electronics Forum | Tue May 06 11:26:52 EDT 2014 | aj

Hi all, Can anyone share the necessary info for printing 0201's? stencil Thickness, grade of steel, 1:1 etc Thanks in advance, AJ

Step stencil troubles

Electronics Forum | Fri Sep 17 13:24:27 EDT 2004 | Bob R.

I also agree with Russ - we use step stencils when we have to but generally try to avoid them because the print isn't as consistent as with a single thickness stencil. Many of our products are for harsh environments so we do a lot of thermal cycle a

0201 (0603) stencil spec

Electronics Forum | Tue May 06 21:35:27 EDT 2014 | davef

Indium recommendations: 0201's: * Stencil Opening = 11mil x 16mil rectangle * Foot Print = 12mil x 15mil rectangle * Stencil Thickness = 5mils * Spacing = 9mils Note: The most common stencil being utilized, is the laser cut electropolished, and in so

stencil apertures for BGA

Electronics Forum | Fri Apr 11 01:52:26 EDT 2008 | andrzej

0,66 Is it ok ? Is it overprinted r - radius of stencil aperture - 9mils ~ 230um t - stencil thickness - 150um Other data : diameter of soldermas - 26mils Diameter of pad - 18mils Diameter of stencil apertre - 18mils Pitch - 0,8mm ~ 31mils What s

RoHS BGA stencil question

Electronics Forum | Thu Feb 08 14:55:30 EST 2007 | pavel_murtishev

Good evening, I do. 2mil overprint is not critical. Paste will simply flow back. Paste flows back even with larger overprint (up to 15mil at least). 5mil stencil thickness if fine also. BGA area ratio for both BGAs is higher than 0.66 required by IP

stencil apertures for BGA

Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej

Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio

measument of paste thickness after Screen Printing

Electronics Forum | Tue Sep 07 09:53:37 EDT 2004 | rob

Hi Dhanashekar, I'm with Chris on this one, unless you are carrying out 0201 or ultra fine pitch placement it's a helpful but not critical tool. We found most print errors were avoided using the 2D vision on the printer, combined with plenty of aut


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