New SMT Equipment: thermal pad (Page 6 of 21)

PACE ST 75 Analog Desoldering Station

PACE ST 75 Analog Desoldering Station

New Equipment | Rework & Repair Equipment

There are no complicated controls to worry about with PACE's ST 75 ... just turn a dial to the temperature you need and you're ready to desolder! Self-Contained, Expandable Desoldering Station The ST 75 is a completely self-contained desoldering sy

PACE Worldwide

PACE ST 115 Digital Desoldering Station with SX-100 Sodr-X-Tractor

PACE ST 115 Digital Desoldering Station with SX-100 Sodr-X-Tractor

New Equipment | Rework & Repair Equipment

ST 115 Digital Desoldering Station with SX-100 Sodr-X-Tractor           PACE's ST 115 features simplified interface with digital display and soft buttons, just push the arrow keys up or down to change temperature from 500-850°F (260-454°C) Fully P

PACE Worldwide

E3M SMD Rework System for Micro Re Work

E3M SMD Rework System for Micro Re Work

New Equipment | Rework & Repair Equipment

PDR E3M  Rework System for Micro SMD Rework is made of only the finest materials and components for Micro- BGA Rework, 0201 Rework, CSP Rework, uBGA Rework, LED Rework, area Array Rework, and similar micro applications. Combining PDR's ThermoActive s

PDR-America

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

ELAU Schneider  MC-4/11/10/400 SERVO DRIVE

ELAU Schneider MC-4/11/10/400 SERVO DRIVE

New Equipment | Industrial Automation

 Sales Manager: Sandy Lin Email:  unity@mvme.cn Skype:  onlywnn_1 Mobile(Whatsapp): (+86)-18020776786   XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC,

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Bosch VM 60-T Nr. 047888-320

Bosch VM 60-T Nr. 047888-320

New Equipment | Industrial Automation

Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Moore Automation Limited Our services  Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)War

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Flason SMT Reflow Oven M8

Flason SMT Reflow Oven M8

New Equipment | Reflow

Flason SMT Reflow Oven M8 Name: SMT Reflow Oven Heating zones: 8 Heating method: Hot Air Usage: SMT Assembly line Product description: SMT Reflow Oven  INQUIRY SMT reflow oven Introduction of SMT Reflow Oven: SMT Reflow oven is mainl

Flason Electronic Co.,limited

SMT Reflow Oven M8

SMT Reflow Oven M8

New Equipment | Reflow

SMT Reflow Oven M8 Heating zones: 8 Heating method: Hot Air Heating passage 2900MM Dimension(L*W*H) 4400×1100×1490mm Product description: SMT Reflow Oven M8,Heating zones: 8,Heating method: Hot Air,Heating passage 2900MM,Dimension(

Kait High Tech Co.,ltd

SMD Reflow Oven F8

SMD Reflow Oven F8

New Equipment | Reflow

SMD Reflow Oven F8 Name: SMD Reflow Oven Heating zones: 8 Heating method: Hot Air Usage: SMT Assembly line Product description: SMD Reflow Oven   SMD Reflow Oven F8 Introduction of SMD Reflow Oven: SMD reflow oven is mainly for

Kait High Tech Co.,ltd


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