Electronics Forum: thermocouples and location (Page 6 of 17)

Fuji CP6 and IP3 specifications request

Electronics Forum | Fri Aug 05 08:15:39 EDT 2016 | jdengler

The IP3 specs are: PCB Dimensions Max: 508 mm x 457 mm - Min: 80mm x 50mm Thickness: 0.8 to 4.0mm Component Capacity Tape: 74 - 8/12mm Device Locations Tray: 40 Locations Placing Rate: 0.55 sec/component for small chips 1.25 sec/component for ICs

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 20:55:33 EDT 2002 | scottefiske

I'm with you dave...please provide specifics as to defect condition... Are you getting good wetting to both land and lead? Is there any repeatability to lead/location/device? Do you have paste inspection capabilites to verify deposition? Is it a Pala

Training for Philips and Quad in Oregon

Electronics Forum | Mon Oct 15 15:05:13 EDT 2012 | bobpan

Hello Mike, I can help with the Quad training but unfortunatley not the Philips. Also I am located in Pennsylvania....so if you cant find anyone near you....shoot me an e-mail. Go to www.precision-repairs.com Professional and Reasonable Thanks, B

Ekra E5 language change and manual needed

Electronics Forum | Wed Jun 13 19:25:00 EDT 2018 | chavez

I HAD THAT SAME PROBLEM. I TRIED TO FIND THE PAPER ON HOW TO CHANGE TO ENGLISH. i COULD NOT LOCATE IT. CONTACT Galena, Evita ABD SHE WILL BE ABLE TO HELP.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Fri Aug 09 03:59:35 EDT 2019 | sssamw

Did you check the pin location accuracy before placement? I mean if possible pin was hit or misaligned a little before placement, so the pin cannot inserted in hole then bent. And maybe you need contact your component supplier to study together.

FKN Systek N200 parts and manual depanelizer

Electronics Forum | Tue Jun 29 20:29:21 EDT 2021 | cbeneat

fkn@fknsystek.com,Werner Christ. They are located in Ma. He will be able to help you.

Stencil Bleed - Bridges and Solder Balls

Electronics Forum | Mon Aug 14 13:08:00 EDT 2023 | dimamalin

Similar issues arose for me in cases where the contact pads of components were located below the solder mask level. Ordering a thinner stencil might potentially solve the problem.

Pick and Place Camera sees Red

Electronics Forum | Thu Sep 08 11:56:37 EDT 2005 | siverts

I have seen this before. Sounds like that You are having problem with the vision box, located in the rear left of the machine; that is if you are using the old vision system, the newer Lantern vision card is located in the VME chassi in lower front r

Re: IPC Standards and ISO 9000

Electronics Forum | Thu Dec 07 09:07:28 EST 2000 | Mike Andrews

Have you tried contacting your locat MEP (Manufacturer's Extension Partnership)? Here in New England at least they have a good reputation and I have personally found them to be a great resource. Use the link below to get to their national site - ther

Solder paste height and metal squeegees

Electronics Forum | Fri Apr 20 11:05:23 EDT 2001 | gcs

Just a bullet! My results are, .005" stencil thickness should measure between .0055" - .006" if your pressure is correct, metal blades and snap-off is set up correctly. Do you have aperture reductions at the QFP locations "typicial industry standard


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