Industry News: track and pattern (Page 6 of 41)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2016-06-15 20:10:27.0

The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open. Taking place September 25 - 29, 2016 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings.

Surface Mount Technology Association (SMTA)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2017-06-08 15:11:11.0

The SMTA is pleased to announce that the program for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai and registration is open. Taking place September 17-21, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2012-08-02 11:47:58.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

IPC Report Details How PCB Manufacturers Meet Current and Future Technology Demands

Industry News | 2017-05-16 17:59:37.0

PCB Technology Trends 2016, a global study published this month by IPC – Association Connecting Electronics Industries®, is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2021 that will affect the whole industry.

Association Connecting Electronics Industries (IPC)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

Advances in Lead-Free Alloys, Reliability, Halogen-Free and Counterfeit Components Highlight IPC APEX EXPO 2012 Technical Conference

Industry News | 2011-12-14 15:47:27.0

Featuring new research and innovations in printed board design and manufacturing, electronics assembly and test, the IPC APEX EXPO® technical conference will be held at the San Diego Convention Center, February 28-March 1, 2012.

Association Connecting Electronics Industries (IPC)

Count On Tools Inc. to Unveil StripFeeder .mod V2 and Repair Services at SMTA International

Industry News | 2013-09-13 13:40:43.0

Count On Tools Inc. (COT)will introduce its new StripFeeder Modular (.mod) System version 2 in Booth #618 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

Count On Tools, Inc.

Nordson ASYMTEK Receives Innovation and Vision Awards Auto Dual Simultaneous System honored at NEPCON China

Industry News | 2017-05-24 17:05:03.0

Nordson ASYMTEK received two prestigious awards for innovative technology during NEPCON China 2017: the Innovation Award from Electronics Manufacturing (EM) Asia in the category of Special Systems--Dispensing Systems and the VISION Award for Innovative Products & Services in Surface Mount from SMT China magazine in the Dispensing and Conformal Coating category. The awards were presented for achievement in innovation and product excellence for Nordson ASYMTEK's Auto Dual Simultaneous (ADS) System. Nordson ASYMTEK products have received these awards every year the awards were in existence.

ASYMTEK Products | Nordson Electronics Solutions

Four IPC APEX EXPO Exhibiting Companies Push Boundaries of Technology and Earn 2018 Innovation Awards

Industry News | 2018-02-26 10:51:50.0

IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2018 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and On-line Registration Now Open

Industry News | 2009-07-24 14:12:49.0

Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)


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