Industry News | 2012-06-25 12:49:28.0
Nihon Superior, will introduce a new product, SN100C P810 D4 low-voiding lead-free solder paste, at the upcoming IPCA International Expo, scheduled to take place July 25-27, 2012 at the KTPO Trade Centre in Bangalore, India.
Industry News | 2013-06-07 14:37:14.0
Hesse Mechatronics will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.
Industry News | 2018-03-05 16:07:28.0
StratEdge Corporation announces that it will display its high-frequency and very high-power device packages in booth 62 at the IMAPS Device Conference. The conference is being held March 6 and 7th at WekoPa Resort and Casino in Fountain Hills, Arizona.
Industry News | 2022-03-18 16:24:08.0
OR-01 OhmRanger-LCV™ has been designed as a portable instrument for measuring the resistance of delicate components by using a very low stimulus voltage to avoid damaging the device being tested.
Industry News | 2024-01-23 15:41:10.0
Koh Young Technology, the leader in True3D™ measurement-based inspection solutions, will be speaking at the SMTA Wafer-Level Packaging Symposium in Burlingame, California on our Multimodal Phase Shift Optics Approach to revolutionize high-speed 3D reconstruction of semiconductor and advanced packages. In the presentation will highlight how high-speed 3D reconstruction addresses the growing demand for electronic components, which necessitates fast and efficient processing. These advancements in measurement technology and AI integration have paved the way for enhanced packaging applications in the semiconductor industry.
Industry News | 2003-06-11 13:37:07.0
With efficiencies better or comparable to competing implementations in the MLF/QFN/Power Block packages, these new devices in the LITTLE FOOT SO 16 feature a 38% or smaller standard footprint, simplifying design, assembly, soldering, and layout.
Industry News | 2014-03-13 11:57:36.0
What does it take to make it to 80 years in an industry where today's technology is obsolete tomorrow? For Indium Corporation, it takes foresight and dedication.
Industry News | 2014-03-24 13:39:01.0
A consortium of partners will launch the world's first flexible timer based on printed electronics at the IDTechEx Printed Electronics Europe event in Berlin, April 1-2. The device consists of an electronic logic circuit implemented with thin film metal oxide transistors, powered by a printed battery, and integrated onto a paper substrate. It has four timing sequences and is designed for multi-functional use across four different applications.
Industry News | 2001-08-10 07:53:10.0
SAMSUNG has shipped the first engineering samples of a MCP device integrating 64Mb NAND-type flash memory and 8Mb SRAM. * Cost#ffective optimal solution for 3G mobile phones. * Mass production set for the second quarter of 2001.
Industry News | 2002-05-16 16:53:54.0
New Family of 12 Automated Accelerated Reliability Test Systems (AARTS) Starting at $99K
