Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean
Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de
Electronics Forum | Tue Feb 08 14:49:23 EST 2000 | Travis Slaughter
I have never tried this and wouldn�t really even want to consider it. Epoxy generally cures at around 160c in a fairly short amount of time, solder paste requires much more time and a peek temperature of about 210c or more in some cases. Curing you
Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef
Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur
Electronics Forum | Fri Aug 27 10:25:52 EDT 1999 | Matthew Park
Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective wav
Electronics Forum | Thu Apr 21 12:35:15 EDT 2005 | jdumont
Well that doesnt sound very promising. What im going to do is make sure these two boards I just coated (with the RTV already cured) will be used in house only. In the future we will do any conformal coating operations before potting with whatever mat
Electronics Forum | Mon Jul 04 11:32:44 EDT 2005 | geb
One of my Universal GSM (1995/ 1996 model) pick and place machines has recently started to drop the nozzle on the reject belt when dropping off a rejected component. I have tried replacing the nozzel holders on the ends of the spindles but with no im
Electronics Forum | Wed Feb 09 22:33:27 EST 2000 | Dave F
All: I don�t think this isn�t what Charlie was asking about, but since he�s got our juices flowing on the topic, does anyone have a sense about running paste and adhesive at the same time, beyond the issues that we spoke about in responding to Charl
Electronics Forum | Thu Feb 10 16:00:31 EST 2000 | Travis Slaughter
I have had cases when it was necessary to run epoxy and paste at the same time. The only good reason I know of to even think about messing with going to this trouble is if the surface tension of the solder melting pulls the part out of alignment. T
Electronics Forum | Thu Apr 28 11:14:27 EDT 2005 | bbarr
If you apply the RTV after coating, what happens to bond strength since you are now bonding to the coating and not the board? Will the caps still survive vibration and shock? I specify applying RTV before coating for this reason. Am I correct? I als
Electronics Forum | Thu Jul 06 03:03:56 EDT 2006 | ronalds
Thank you all for your input. The MF300S Multicore flux is rated for lead free. There is not much dross or contamination. We are using nitrogen. I've tested the boards with the curing test of IPC-TM-650. I think you're all right about the preheat.
