Industry News | 2009-05-29 13:48:27.0
NORTH BILLERICA, Mass. � (BUSINESS WIRE) � May 29, 2009 � BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment and processes for the alternative energy and electronics assembly markets, today announced the hiring of Jan-Paul van Maaren, Ph.D., as vice president marketing.
Industry News | 2011-10-21 14:40:51.0
Two experienced sales engineers have joined Ersa GmbH in Wertheim, Europe’s largest supplier of soldering equipment: Michael Koch and Tobias van Rossem have been working in the sales of Ersa soldering systems and screen printers since September.
Career Center | Van Nuys, California USA | Engineering,Production,Quality Control
Test Technician: Looking for an experience Test Technician with the capabilities to troubleshoot PCBs. The candidate should have the following knowledge. * able to read and interpret schematics * able to troubleshoot only using the schematics * 2-
Events Calendar | Wed Sep 15 00:00:00 EDT 2021 - Fri Sep 17 00:00:00 EDT 2021 | Hanoi, Vietnam
NEPCON Vietnam 2021
Industry News | 2012-04-20 17:28:49.0
Redmond - WA –April 20, / Dynamic Systems, Inc., a Redmond, Washington software developer specializing in barcode data collection, has announced the release of SIMBA Lite 2012, which is designed to provide fresh food processors the ability to process, label and track their products from “field or dock to customer”.
Industry News | 2012-04-20 17:28:50.0
Redmond - WA –April 20, / Dynamic Systems, Inc., a Redmond, Washington software developer specializing in barcode data collection, has announced the release of SIMBA Lite 2012, which is designed to provide fresh food processors the ability to process, label and track their products from “field or dock to customer”.
New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 Yuehang: Shipping Term : TNT,DHL,FEDEX,ETC Payment Term : T/T Warranty: 12 month yuehang supply： New+original+factory sealed+high quality
Technical Library | 2021-11-03 16:49:59.0
Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.
Events Calendar | Wed Aug 08 00:00:00 EDT 2018 - Fri Aug 10 00:00:00 EDT 2018 | Hanoi, Vietnam
Vietnam Manufacturing Expo 2018
Events Calendar | Wed Aug 08 00:00:00 EDT 2018 - Fri Aug 10 00:00:00 EDT 2018 | Hanoi, Vietnam
ROBOT X @Vietnam Manufacturing Expo
