Industry News | 2017-08-10 17:50:15.0
Engineered Material Systems is pleased to introduce the DF-3590 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2019-02-21 07:22:25.0
Engineered Material Systemsis pleased to announce the availability of its NR-5000 series liquid negative photoresists for microfluidics and wafer level metallization processes. These material formulations have viscosities optimized for wafer coatings from 5 to 50 µm in thickness.
Industry News | 2016-09-08 13:30:10.0
Engineered Material Systems is pleased to introduce the DF-3520 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2017-01-09 18:11:30.0
Engineered Material Systems is pleased to introduce the DF-3560 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2022-04-28 14:14:09.0
Indium Corporation®'s Leo Hu, senior area technical manager – East China, will share the challenges and solutions of fine feature solder paste printing for system-in-package (SiP) at SiP Conference China, May 19, Shanghai, China.
Industry News | 2013-06-14 17:52:56.0
Engineered Material Systems, Inc., introduces NR-2500 Liquid Negative Photoresist for use in micro-electromechanical systems (MEMS).
Industry News | 2013-10-29 13:26:58.0
Engineered Material Systems, Inc., is pleased to introduce the DF-3020 Dry Film Negative Photoresist for use in micro-electro-mechanical systems (MEMS).
Industry News | 2017-10-22 17:38:10.0
Engineered Material Systems is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2017-03-20 17:31:31.0
Engineered Material Systems is pleased to introduce the DF-35120 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). The dry film is 120 µm thick. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2008-06-11 17:44:06.0
LIVERMORE, Calif.--(BUSINESS WIRE)--June 10, 2008--Adept Technology, Inc. (NASDAQ:ADEP), the leading provider of intelligent vision-guided robotics and global robotics services, today announced it will present the Adept Quattro s650 robot on its booth (Hall B5, Stand 220) at Intersolar 2008, the world's largest solar trade fair, in Munich, Germany, June 12-14.
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