The BGA Inspector standalone tool allows you to perform a complete BGA analysis on any computer platform.
The X2 is an advanced In-line X-RAY inspection system designed for high-speed automatic inspection in production lines. Transmission X-RAY technology is combined with patented Slice-Filter-Technology (SFT) for double-sided PCB assembly and component
Industry News | 2015-01-15 21:53:14.0
Indium Corporation's Kenneth Thum, senior technical support engineer, and Nguyen Viet Truong, assistant technical manager for Asia Pacific operations, will present at the upcoming IPC Conferences on Assembly and Reliability in Vietnam and Thailand.
Industry News | 2022-01-10 16:39:30.0
Indium Corporation's Ron Lasky, Ph.D., PE, senior technologist, will share his industry knowledge and expertise during two presentations at the SMTA Pan Pacific Microelectronics Symposium (SMTA PanPac), Jan. 31-Feb. 3, Honolulu, O'ahu, Hawaii, U.S.
Technical Library | 2015-07-14 13:19:10.0
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.
The perfect solution for a cost-effective yet powerful x-ray inspection system. The TruView™ Prime is a fully motorized radiography system developed to meet the stringent requirements of electronics assembly and component inspection. The TruView Pri
Industry News | 2014-07-06 12:48:55.0
If you have problems with voids in area array packages or bubbles in conformal coating? Lets fix these together in September at SMTA International. There are many different reasons why some defects occur so lets look at the common reasons and see which is your best solution.
Automated inspection system designed for sophisticated high-speed inspection in SMT production. Transmission X-ray Technology with patented Slice-Filter-Technique (SFT) and Off-Axis Technology present a reliable solution for the in-line inspection of
Automated inspection system designed for high-speed final inspection of printed circuit boards and complete assemblies. The X2.5L is based on the well-established MatriX X2.5 system series. It is configured with a new generation of TDI X-ray cameras
Industry News | 2014-08-14 21:44:44.0
Several Indium Corporation experts will share their technical knowledge with attendees at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.
