Electronics Forum: why used esd devices (Page 6 of 23)

Disadvantages of using the ultrasonic cleaners - PCB cleaning

Electronics Forum | Fri Aug 22 13:10:51 EDT 2008 | bschreiber

The folowing articles are available at: http://www.smartsonic.com/article.html "Why Not Ultrasonic Cleaning?" by William Kenyon "Damage-Free Ultrasonically-Assisted Cleaning of Printed Circuit Assemblies" - by B.P. Richards et al "Does Ultrason

Why do voltages fall in SMT?

Electronics Forum | Mon Sep 20 10:17:19 EDT 1999 | Jeanjean

Hi all, As a student in elctronic sciences, I'd like to know why there is a difference in the voltage required for PC boards with surface mounted devices and the voltage needed by traditionnal components like leaded film capacitors? I wonder if it

LGA Solder Balls

Electronics Forum | Tue Mar 08 15:35:43 EST 2016 | fuji_user_2014

I am having problems with LGA solder balls under the devices. Here are some of the details: 1. There are only 2 affected parts @4 locations. 2. The parts are LTM4616EV#PBF and LTM4608AEV#PBF. 3. We are using a ramp soak spike profile. 0-100secs=r

Moisture sensitive Devices

Electronics Forum | Tue Feb 08 12:39:52 EST 2000 | Ashok Dhawan

I have three questions on moisture sensitive devices: 1. What is general practice on incoming / receiving inspection of moisture sensitive devices- which boils down to mostly FPDs and BGAs ? Traditionally, FPD packs were opened only at time of use

Re-Reflowing PCB's

Electronics Forum | Mon Oct 13 14:30:56 EDT 2003 | jsherrow

Our customer is starting to see some solder joint > failures during their extensive testing > proceedures. Specifically with an SMD/DIP device > that has a very small foot in relationship with > the pad on the PCB. (By SMD/DIP device I mean a >

How actually the process of Electrofoam Stencil?

Electronics Forum | Fri Jan 07 13:17:48 EST 2005 | bschreiber

3) There are several papers on the safety of cleaning PCBs and ICs using ultrasonic technology. The latest is in the October 2004 issue of SMT magazine by William Kenyon, "Why Not Ultrasonics?" Most of the studies have been performed by Dr. B.P. Ri

Low Voltage Device damage on z18xx ICT

Electronics Forum | Tue Nov 25 11:58:31 EST 2008 | rway

Hello all, We are using z1850/60 machines. The APC test is damaging a 1.8V device on the board. The APC stimulates -/+3Vdc in fast mode. I understand the dangers of over-voltage. But what I need to know is how the part is being damaged when the ent

No residue low tack adhesive film for registration

Electronics Forum | Thu Feb 15 19:44:50 EST 2001 | davef

I assume Roland [er someone like that] explained on the Main Conference also known as the Forum, the blue "New Thread" button near the middle of the page and 1 1/2" in from the right margin as the preferred way for posting a new thread. [Well, if th

No-Clean flux residue and RF application

Electronics Forum | Tue Aug 30 15:05:23 EDT 2005 | Shean Dalton

Dear Ing, Have you analyzed why some RF device aren't operational after washing? An assumption is that failures are related to the ultrasonic energy applied. Other possibilities are for poor rinsing, poor drying, inadequate washing on those failed

BGA Baking in Reels?

Electronics Forum | Fri Feb 01 15:09:43 EST 2008 | chef

Don't do it.!!!! Are you nucking futs? Why is pre-bake required? Are you producing in high humidity? Is the package of the device poroues enough to suck in moisture? Think, consider you will not get an even "bake", the outside of the reel will get


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