Electronics Forum | Fri Dec 16 13:37:52 EST 2016 | edhare
Hi all, > > Recently, we are trying to do > wire bonding between a 75 * 75 um pad on a chip > and substrate with 150 um height difference, but > when completing wire bonding and the wire bonds > on pad and substrate, the pad will get out of
Electronics Forum | Thu Nov 03 07:43:52 EST 2005 | davef
Questions are: * Is the problem 'wire bonds that don't stick' or 'wire bonds that fall or break off later'? * What materials are you working with? * What is your working time after plasma clean? * What does surface analysis tell you about surface con
Electronics Forum | Sun Jan 22 09:44:17 EST 2006 | davef
Wire bonding is a die connect methodology that runs either gold or aluminum wires between pads on the integrated circuit to either a lead frame or pads on a printed circuit board. For more look here on Daan Terstegge's excellent link page http://www
Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef
Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt
Electronics Forum | Mon Aug 02 11:44:49 EDT 2004 | jbabson1
If you do wire bond before printing, Photo Stencil (www.photostencil.com)can help you design a stencil with relief on the pwb side for the wirebonding.
Electronics Forum | Tue Feb 08 11:14:45 EST 2005 | George
Have a customer that needs to find someone that can do Chip on board Wire bonding automated only. You folks know of anyone? We are in the Newengland Area. You know, where the Patriots reside?
Electronics Forum | Thu Feb 26 10:06:12 EST 2009 | bandjwet
Does anyone know of any vendors who can supply "dummy" parts to practice ball wire bonding of gold to help train/certify operators? Thanks BWET
Electronics Forum | Thu Jan 06 23:07:48 EST 2011 | essohn
Hello~ I need your expoertised experience. Do you have any experience of Saponifier influence on Al pad for wire bonding. We have a porblem of no wire bonding in use of saponifier in order to remove clean type flux. thanks in advance
Electronics Forum | Wed Dec 14 20:17:48 EST 2016 | davef
As I understand, you are wire bond gold wire to gold pad, where the substrate has good bond strength, but the die does not. If bond quality is good, and then drops off rapidly, then it's probably something to do with contamination within the system
Electronics Forum | Fri Nov 27 02:09:50 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
