New SMT Equipment: wire bond plating (Page 6 of 183)

Bonding Wire

Bonding Wire

New Equipment | Components

Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr

Plastlist Group

Copper Bonded Earth Plates / Lattice Copper

Copper Bonded Earth Plates / Lattice Copper

New Equipment | Components

We manufacture and export Copper Bonded Earth Plates - Lattice Copper that provides a long lasting earthing solution in places where driving earth rods might be impractical. They are often installed in conjunction with Low-Resistance Earthing Compoun

Brass Neutral Links

Wire Clamp / Cutter

Wire Clamp / Cutter

New Equipment | Components

For Wire Bonding (Heavy Wire Wedge Bonding)

K-Net International Ltd.,Part

Electronics OEM ODM Manufacture

Electronics OEM ODM Manufacture

New Equipment |  

Tronixlink's Electronic Contract Manufacturing Service (EMS) PCBA layout Prototype builds Printed Circuit Board Assembly (PCBA) - Single sided , Double sided , Multilayer, Backplanes, Industrial Power boards, Wire Wrap boards, Fine-line , Analog ,

Tronixlink PCB PCBA

Wedge

Wedge

New Equipment | Other

For Wire Bonding (Wedge Bonding) with follow types; Fine Wire Wedge Heavy Wire Wedge Ribbon Wire Wedge

K-Net International Ltd.,Part

SMT Assembly, Aluminum Bonding Wire

New Equipment |  

Tianjin Advanced Electronics Co., Ltd. is one Hi-Tech company. Special in semiconductor material and brazing. Provide fine bonding wire, including COB(chip on board) Al Si1% and pure gold wire. Advanced manufacturing technology and equipment .Whole

Advanced Electronics Co.,Ltd.

Advanced Thermal Management

Advanced Thermal Management

New Equipment | Assembly Services

S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with

S-Bond Technologies

Manual Wire Bonder

Manual Wire Bonder

New Equipment | Other

For Wire Bonding (Wedge and Ball Bonding)

K-Net International Ltd.,Part

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

New Equipment | IC Packaging

The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia

Hesse Mechatronics

Aluminum Bonded Copper

Aluminum Bonded Copper

New Equipment |  

Aluminum Bonded Copper or �ABC� represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC�s product technology. Critical m

Oak Mitsui Inc.


wire bond plating searches for Companies, Equipment, Machines, Suppliers & Information

Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Reflow Soldering 101 Training Course
PCB Handling Machine with CE

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PCB Handling with CE

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Low-cost, self-paced, online training on electronics manufacturing fundamentals