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New Viscom 3D AOI line-up and 360View feature for improved 3D inspection

Industry News | 2016-07-26 18:48:27.0

Viscom today announced plans to introduce its new 3D AOI line-up to Asian markets, highlighting its new 360View feature in Stand 1F35 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Centre.

Viscom AG

MVP Expands the Application of the 900 and Versa Platforms at IPC APEX EXPO 2022

Industry News | 2022-01-19 12:07:24.0

Vista, CA – January 18, 2022. Machine Vision Products, Inc. (MVP) will be demonstrating its capability for inspection and metrology across a broad range of applications in SMT and MicroElectronics. This will be supported on its two core platforms, the 900 and Versa Series of AutoInspectors. The 900 platform is designed for microelectronics applications while the Versa is aligned to SMT and SPI inspection.

Machine Vision Products, Inc

MVP adds Major Inspection Capabilities, Groundbreaking New Software and showcases AI and Deep Learning at IPC APEX EXPO 2023

Industry News | 2023-01-18 11:19:25.0

Vista, CA – January 18, 2023. Machine Vision Products, Inc (MVP) will be exhibiting on booth 924 at the IPC Apex Expo 2023 in the San Diego Convention Center between January 24-26.

Machine Vision Products, Inc

Machine Vision Products Demonstrates 850G Solutions For Inspection Of Back-End Processes Including Lead-Frames, Wire-Bond, Die And Epoxy At Semicon Taiwan 2012

Industry News | 2012-08-31 12:32:09.0

Carlsbad, CA – September 1, 2012: Machine Vision Products today announced they would be demonstrating their 850G Inspection solutions at the Semicon Taiwan 2012 exhibition. The exhibition is at the Taipei World Trade Center, Nangang Hall in Taipei, Taiwan from September 5-7 2012. Machine Vision Products are exhibiting on Booth #960 with Sigmatek Corp.

Machine Vision Products, Inc

AI Technology, Inc (AIT) To Attend and Present Paper at IWLPC. AIT also attending IPC/SMTA High-Reliability Cleaning and Conformal Coating Conference.

Industry News | 2014-11-07 10:35:14.0

AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.

AI Technology, Inc. (AIT)

Practical Components to Exhibit Advanced Technologies at IPC APEX 2020

Industry News | 2020-01-07 11:42:27.0

Practical Components announces that it will showcase its advanced technologies at the IPC APEX exhibition in booth 1600 scheduled to take place February 4-6, 2020 at the San Diego Convention Center in San Diego California.

Practical Components, Inc.

Perllo Technologies Introduces Extec�s new line of Steel-Inked and 3-D Thick Film Hybrid Technology into US Marketplace

Industry News | 2004-11-19 15:47:39.0

Perllo Technologies LLC is pleased to announce its new partnership with Extec Integrated Systems Limited ("Extec") of Hampshire, United Kingdom.

Perllo Technologies

Machine Vision Products to Introduce their latest Die Wire, Wire-Bond Inspection and Automated Semiconductor Inspection Solutions at Semicon West 2017

Industry News | 2017-07-07 17:15:03.0

Carlsbad, CA – July 7, 2017: Machine Vision Products (MVP) today announced it would be demonstrating its Die Wire Metrology System (DWMS) and Semiconductor Automated Optical Inspection solutions at the Semicon West exhibition. These latest capabilities are available on MVP's 2020 and 850G Platforms. Applications demonstrated will include die wire metrology, wire bond, wafer and surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 11-13, 2017. Machine Vision Products are exhibiting at booth #7724 in the West Hall (Level 1).

Machine Vision Products, Inc

Nordson Test & Inspection Announces Lineup for productronica

Industry News | 2017-10-17 19:47:15.0

Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Hall A2 Booth 445 at productronica 2017, scheduled to take place Nov. 14-17, 2017 at the Messe München in Germany.

Nordson DAGE

wirebonding

Electronics Forum | Fri Aug 14 11:01:43 EDT 2020 | charliedci

Looking for someone who can perform die attach, wirebonding and gloptop services on small quantity of SMT assemblies in the US.


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