315 with good results even on lead-free process results

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

. Since 2005 many tens of millions of lead-free products have been produced and field results show the reliability to be as good (and in many cases better

Surface Mount Technology Association (SMTA)

Basic Requirements for Reflow Soldering Oven-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2019-12-17/13161.chtml

ensure that the basic requirements of soldering are met to ensure good soldering results.  High-quality reflow soldering oven should have the following five basic requirements

CF9 Documentation Package

GPD Global | https://www.gpd-global.com/pdf/lead-former/CF9-Doc-Package-901-1-01.pdf

at the machine's upright plate (Figure 13, Item 1). This position also corresponds with the lead wire point of attachment to the tape. Refer to Taping Specifications on page 30. Backlash is eliminated during station adjustment by three (3) beveled

GPD Global

Best Convection Reflow Oven -Heller Model 1826 Reflow Oven

Heller Industries Inc. | https://hellerindustries.com/convection-reflow/

! That rate meets even the most demanding lead-free profile requirements! Process Control Powered by ECD, this innovative software package provides three levels of process control from Oven CpK, to Process CpK and Product Traceability, this software ensures that all

Heller Industries Inc.

Reflow Ovens -Convection Reflow Ovens For High Volume

Heller Industries Inc. | https://hellerindustries.com/19362043-mark5-smt-reflow-oven/

! That rate meets even the most demanding lead-free profile requirements! Process Control Powered by ECD, this innovative software package provides three levels of process control from Oven CpK, to Process CpK and Product Traceability, this software ensures that all

Heller Industries Inc.

MK5 Reflow Oven for High Volume Reflow Soldering

Heller Industries Inc. | https://hellerindustries.com/product/19362043-mark5-smt-reflow-oven/

C/sec - even on LGA 775! That rate meets even the most demanding lead-free profile requirements! Process Control Powered by ECD, this innovative software package provides three levels of process control from Oven CpK, to Process CpK and Product Traceability, this software ensures that all

Heller Industries Inc.

Soldering Aluminum Wire - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/soldering-aluminum-wire/

. If the product is new, or was built after 2008, then the lead-free solder is a must to do this work. I would contact the solder manufactures to find out exactly which alloy is best to use for this application and which flux they would recommend, so you can achieve a good solder joint

 Using Pb free components in Sn/Pb process 6 Issues  Will the tin-lead solder process completely reflow the lead-free ball on BGA components

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

Convection Reflow Oven –1826

Heller Industries Inc. | https://hellerindustries.com/convection-reflow-oven-1826-mark5/

! That rate meets even the most demanding lead-free profile requirements! Process Control Powered by ECD, this innovative software package provides three levels of process control from Oven CpK, to Process CpK and Product Traceability, this software ensures that all

Heller Industries Inc.

Convection Reflow Oven –1826

Heller Industries Inc. | https://hellerindustries.com/product/1826-mark5-smt-reflow-oven/

C/sec - even on LGA 775! That rate meets even the most demanding lead-free profile requirements! Process Control Powered by ECD, this innovative software package provides three levels of process control from Oven CpK, to Process CpK and Product Traceability, this software ensures that all

Heller Industries Inc.