Electronics Forum | Wed Mar 13 10:20:51 EST 2002 | IAN T
WE HAVE A PROBLEM WITH SOLDER BALLING POST REFLOW WE ARE RELIABLY DISPENCING HERAEUS PASTE WITH A XY FLEX BUT WE'RE GETTING LARGE BALLS ON THE MELFS AND SMALL BALLS ON MOST CHIP PARTS WHAT SHOULD I BE LOOKING FOR? AND IS PAD DESIGN AN ISSUE (ROUND DO
Electronics Forum | Thu Jul 20 14:52:05 EDT 2000 | Bob Willis
If you are talking about Pin In Hole Reflow that is not true, I hope it was not my friends at Speedline that told you that. Stencil printing of paste for through hole reflow can be done. If you get all the parameters right it can give you joints lik
Electronics Forum | Wed Mar 29 09:39:45 EST 2000 | JAX
Garo, Minor voiding in Ball Grid Array solder joints is common, and not considered a threat to reliability. The biggest cause of open solder joints caused by voids is the outgassing of moisture. They are formed when pockets of gas are trapped durin
Electronics Forum | Mon Apr 21 06:26:28 EDT 2003 | Grant
Hi, We have a SMT production like, however we have very little experience with through hole assembly. We design everything to be completly SMT based, however connectors are the only part of our product that still requires through hole assembly. Cur
Electronics Forum | Tue Oct 07 08:59:33 EDT 2003 | caldon
Will Philadelphia Work? My SMTA colleagues and I are putting together a Q/A. We will be having a panel discussion on Lead free on Oct 29. The panel is made up of industry leaders. Aim Solder- David Suraski, Cookson/Alpha/Electronic Assembly Materials
Electronics Forum | Thu Nov 05 13:38:43 EST 2009 | davef
Martin It might be possible to mount a deballed BGA as you mount a QFN. Thinking about doing it, it could be a lot more difficult than first thought. When you heat a BGA, it 'dances' on the board because of the different CTE of the materials involved
Electronics Forum | Wed Aug 04 18:57:26 EDT 1999 | Dreamsniper
| What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | Hi Judy, In profiling you need an understanding of the reflow specs from the solder paste manufacturer then you nee
Electronics Forum | Wed Sep 05 07:07:25 EDT 2007 | mun4o
hi, I have a big problem with soldering uP QFP144 package.All components in PCB are small, only this chip is big and I can't make good temperature profile.Solder joints of other components are shining and with good wetting, but in QFP leads solder j
Electronics Forum | Fri Jun 24 04:51:38 EDT 2016 | unix60959
Hello, Does anyone know where I can find any information or documentation on the miniwave height sensor and control. I feel like the company I'm working for is possibly using the machine incorrectly in this regard. I assume, but would like to verify
Electronics Forum | Wed Feb 25 16:39:29 EST 1998 | Eldon Sanders
I agree with Chrys, get the spike temp up and wetting is not a problem. However, when the palladium mixes in with the solder the joint will become more brittle. You need to make sure enough solder is printed on the board to minimize the concentrati
