Electronics Forum | Mon Dec 13 10:12:45 EST 1999 | John Thorup
Hi Dennis The gold plating on a circuit board is present to protect the nickle plating from corrosion. The layer is so thin that as it goes into solution in the solder it constitutes only a small percentage of the total joint. It is commonly accept
Electronics Forum | Fri Dec 03 14:33:18 EST 1999 | John Thorup
Hi Cunli I guess it's too much to hope for that you're back but it's nice that you're still paying attention . I've used the printer friendly version before and it worked fine. However it does't always work. I'm holding Dave F's posting (help with
Electronics Forum | Tue Dec 07 21:28:00 EST 1999 | sosina outry
I had read all three reply to the interval of pcb in the reflow process already. Like Wolfgang said, base on the profiling and the temp that you set in there. The interval will be base on that temp. Some might have a gap of one pcb lenght, some mig
Electronics Forum | Thu Dec 02 23:43:23 EST 1999 | Kantesh Doss
We have a serious misalignment problem of D-Pak components (Specifically Motorola's part number MJD-3055/MJD-2955)following reflow soldering process. We are using Alpha Metals UP78 solder paste. Our reflow oven is Nitrogen inerted and our oxygen leve
Electronics Forum | Thu Dec 02 09:56:32 EST 1999 | Larry Johnson
Okay, I believe that the XY table on our CP4-2 is not working correctly. When we place smaller parts (603,805,RNETS, etc...) they aren't seated in the paste all the way. Larger parts aren't a problem. They are kind of "floating" on top of the paste.
Electronics Forum | Thu Dec 02 09:45:02 EST 1999 | Larry Johnson
Okay, I believe that the XY table on our CP4-2 is not working correctly. When we place smaller parts (603,805,RNETS, etc...) they aren't seated in the paste all the way. Larger parts aren't a problem. They are kind of "floating" on top of the paste.
Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.
Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i
Electronics Forum | Wed Dec 08 17:58:44 EST 1999 | Dave F
Dave: You should see a solder smudge on the gold plating where the ball was attached, if there is (was) solder reflow during either the (1) BGA fabrication, (2) your BGA attach, and / or (3) your BGA removal. You rework will not remove the solder
Electronics Forum | Thu Dec 02 01:24:57 EST 1999 | CS Tan
Hi Dick; I don't know what business you are in. If you are doing your own products, then outsourcing can be a very good decision. But if you are doing OEM for someone else, then you must invest in SMT if you want to stay in business. But from my expe
Electronics Forum | Fri Dec 03 18:01:39 EST 1999 | Dave F
Chris, Two points of perspective are: 1 Solderability: The shelf life of components has elapsed when they are no longer solderable. There's tons of variables that affect this, but keys are: * Intermetalics grow as a function of temperature. * Th
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