Electronics Forum | Thu Nov 11 18:39:06 EST 1999 | John Thorup
Assuming that you are going to solder them into a board rather than socket them, yes. The thickness of the gold plating in this application will usually make up a large enough percentage of the total joint to threaten enbrittlement. Use a small sol
Electronics Forum | Fri Nov 12 16:27:43 EST 1999 | Michael Allen
The papers I've read suggest that we need to be concerned if the weight percent of gold in the finished joint exceeds 3%. You might want to do the calculations to see where you stand, before you set up a process to "tin" the leads. If you find that
Electronics Forum | Thu Nov 11 20:33:05 EST 1999 | Dave F
Michael: DIGITIZING BOARDS Yech!!! ScanCAD 303.986.7707fax7631 makes a Xerox copier-like thing to copy your board. But why not consider: 1 There are service bureaus that will scan and convert your boards. 2 Why don't you get the gerber data fr
Electronics Forum | Wed Feb 13 17:29:16 EST 2002 | Sheri Connor
Hello Michael, I am new to this SMT Net Forum (sorry to reply so late!)and happened to plug in a search for "scanning". I wanted to make sure you have your questions answered. ScanCAD has the perfect system for you --- ScanPLACE. Please check ou
Electronics Forum | Wed Feb 13 17:33:07 EST 2002 | Sheri Connor
Hi Dave, I wanted to make sure you have current contact information for us: ScanCAD International, Inc. PO Box 598 19181 Hwy 8 Morrison, CO 80465 Phone: 303.697.8888 Fax: 303.697.8580 Not only do we sell our scanning systems, we also have a Serv
Electronics Forum | Sun Nov 21 07:01:14 EST 1999 | Michael stephens
Charley, I have worked on QP242's for 1 and 1/2 years. It is a very reliable machine but like all machines, PM's are very important. When I first got to NOKIA I wasn't familiar with the QP's. Mostly IP3's, IP2's. We are placing 16 mil pitch parts
Electronics Forum | Wed Nov 10 17:39:34 EST 1999 | Dave Vulcano
Hello, Looking for some insight. We just finished a run and experienced a lot of solder balls. We used a no clean paste, nitrogen atmosphere reflow oven, and saw the solder balls on 1206 - 0805 chip components. All of the solder balls appeared and
Electronics Forum | Thu Nov 11 14:55:23 EST 1999 | Dave F
Dave: I think you�re correct. The solder balls are probably from either: � Excessive paste � OR � Paste "exploding/popping" during reflow � OR � Some other variable. Two things: 1 It�s virtually impossible to determine the cause of your ball gen
Electronics Forum | Wed Nov 10 02:20:07 EST 1999 | Marc
The padsfor large heat sinks are being designed on our boards with large copper ground planes surrounding them by our engineers. I am having great difficulty keeping the reflow temperature below 230 degrees in order for the temperature of the copper
Electronics Forum | Tue Nov 09 21:20:28 EST 1999 | Gyver
Hello all, Recently, we had a bad problem of block protection. You know, our programmer can't protect the 29F002 flash ROM, and our motherboard doesn't have 12 volts output for BIOS. So, from the preceding phenomena, it seems impossible to get a prot
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