Electronics Forum | Fri Nov 19 16:36:15 EST 1999 | JAX
Thank you for the info but when I say anchor I am asking if it uses only one ball (pin one). I believe you are saying it uses a predefined number from every corner to map out the part according to the description given inside the GF. If this is true,
Electronics Forum | Wed Nov 24 11:38:42 EST 1999 | John Thorup
Hi Wade As Steve says - are you sure that the lead is in solution? Particulate lead like solder balls is much easier to remove. The answers are going to depend on total output in gallons, maximum flow required and what has to be removed. If you're
Electronics Forum | Wed Nov 24 13:46:23 EST 1999 | STIMP
HI, I BELIEVE LOOKING TOWARDS MACHANICAL PROBLEMS WANT RESOLVE YOUR PROBLEMS.IT SOUNDS MORE LIKE A SOFTWARE OR MAYBE EVEN YOUR CARD GOING BAD. A MACHINE OF ANY BRAND DOES WHAT YOUR PROGRAM TELLS IT TO.IF YOUR PROGRAM SAYS PULL FROM DEVICE 7 AND YO
Electronics Forum | Fri Nov 19 11:07:17 EST 1999 | Bob Smith
Hi John, I don't know of any posters etc. but specs. are available free on-line at www.jedec.com for classification, time out of packaging before baking is required, bake times & temperatures. My understanding is that it only causes a problem if th
Electronics Forum | Thu Nov 18 08:43:30 EST 1999 | Will Buehler
We currently stuff parts on one side and use a reflow oven. We have been told that many companies are stuffing both sides without high-temp solder or glue. I understand that glue is usually only needed for wave soldering processes. Is it true that
Electronics Forum | Wed Nov 17 11:48:12 EST 1999 | Dave F
Larry: Cookson spun Alpha's instruments (omegameters and such) into its specialty coatings group, you know with Paraline and all that. Makes sense to me. Of course, I don't connect with the whole Cookson approach anyhow, but they have money and th
Electronics Forum | Wed Nov 17 11:36:16 EST 1999 | JAX
If this is going to be the beginning of a lucrative and fast growing company you probably want to go with Fuji ( CP series ) , it's by far the fastest and longest lasting. If money is a big issue at this time and you want to get the biggest bang for
Electronics Forum | Fri Nov 19 05:12:21 EST 1999 | Graham Naisbitt
Steve, If you can get me your snail-mail address, I will send you some latest information. We actually have a totally new system called Delta 5. It is Condensation Soldering rather than Vapour phase, the difference being that we solder in an air ti
Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F
John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th
Electronics Forum | Mon Nov 15 12:27:33 EST 1999 | Wolfgang Busko
Hello everybody, engeneering came up with following problem: Considering worst case the get a temperature at a component (Resistor 0805) of 109�C and 99�C at the solderjoints. As a rule of thump I said that the max. suitable temperature for the solde
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